DS1343E-3+ Maxim Integrated Products, DS1343E-3+ Datasheet - Page 2
![no-image](/images/manufacturer_photos/0/4/417/maxim_integrated_products_sml.jpg)
DS1343E-3+
Manufacturer Part Number
DS1343E-3+
Description
Real Time Clock SPI RTC 20P TSSOP 3V 6PF ALRM
Manufacturer
Maxim Integrated Products
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Low-Current SPI/3-Wire RTCs
ABSOLUTE MAXIMUM RATINGS
Voltage Range on V
Voltage Range on Any Nonpower Pin
Operating Temperature Range .......................... -40NC to +85NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
(T
DC ELECTRICAL CHARACTERISTICS
(V
2
Operating Voltage Range
Minimum Timekeeping Voltage
Backup Voltage
Logic 1 Input
Logic 0 Input
Power-Supply Active Current
Power-Supply Standby Current
(Note 5)
Backup Current
(Oscillator Off)
Backup Current
DS1343 (Note 6)
Backup Current
DS1343 (Note 7)
A
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
CC
Relative to Ground ............................................-0.3V to +6.0V
Relative to Ground ................................ -0.3V to (V
= -40°C to +85°C, unless otherwise noted.) (Note 2)
= V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
CC(MIN)
PARAMETER
PARAMETER
to +5.5V, V
CC
or V
BAT
BAT
= +1.3V to +5.5V, T
V
SYMBOL
SYMBOL
BAT
I
I
V
I
I
V
I
BAT1
BAT2
V
CCA
CCS
V
BAT
BAT
CC
IH
IL
T
JC
MIN
) ...............20NC/W
JA
) ..........91NC/W
DS134_-18
DS134_-3
DS134_-33
T
-3 or -33: f
-33: V
V
T
V
V
V
V
A
A
CC
BAT
BAT
BAT
BAT
CC
= +25NC
= +25NC, V
A
= V
= 3V
= V
= 3V
= V
CC
= -40°C to +85°C, unless otherwise noted.) (Notes 2, 3)
+ 0.3V)
CC(MAX)
BAT(MAX)
BAT(MAX)
= 3.63V
SCLK
CC
CONDITIONS
CONDITIONS
= 4MHz (Note 4)
= 0V, EOSC = 1
Junction Temperature Maximum .....................................+150NC
Storage Temperature Range ............................ -55NC to +125NC
Lead Temperature (soldering, 10s) ................................+260NC
Soldering Temperature (reflow) ......................................+260NC
TDFN
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
0.7 x
1.71
V
MIN
MIN
-0.3
2.7
3.0
1.3
CC
TYP
1.15
TYP
250
300
1.8
3.0
3.3
JC
) .................8NC/W
V
JA
MAX
MAX
0.3 x
V
600
120
160
100
500
600
CC
5.5
5.5
5.5
1.3
5.5
0.3
CC
) ..........54NC/W
+
UNITS
UNITS
FA
FA
nA
nA
nA
V
V
V
V
V