FII30-06D IXYS, FII30-06D Datasheet

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FII30-06D

Manufacturer Part Number
FII30-06D
Description
IGBT PHASE LEG ISOPLUS I4-PAC-5
Manufacturer
IXYS
Datasheet
1.FII30-06D.pdf (5 pages)

Specifications of FII30-06D

Igbt Type
NPT
Configuration
Half Bridge
Voltage - Collector Emitter Breakdown (max)
600V
Vce(on) (max) @ Vge, Ic
2.4V @ 15V, 20A
Current - Collector (ic) (max)
30A
Current - Collector Cutoff (max)
600µA
Input Capacitance (cies) @ Vce
1.1nF @ 25V
Power - Max
100W
Input
Standard
Ntc Thermistor
No
Mounting Type
Through Hole
Package / Case
ISOPLUS i4-PAC™
Vces, (v)
600
Ic25, Tc = 25°c, Igbt, (a)
30
Ic90, Tc = 90°c, Igbt, (a)
18
Vce(sat), Typ, Tj = 25°c, Igbt, (v)
1.9
Eoff, Typ, Tj = 125°c, Igbt, (mj)
0.68
Rthjc, Max, Igbt, (k/w)
1.25
Package Style
ISOPLUS i4-PAC™ (5 - Lead)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
IGBT phaseleg
in ISOPLUS i4-PAC™
IXYS reserves the right to change limits, test conditions and dimensions.
© 2011 IXYS All rights reserved
IGBT
Symbol
V
V
I
I
I
V
t
(SCSOA)
P
Symbol
V
V
I
I
t
t
t
t
E
E
C
Q
R
R
CES
GES
C25
C90
CM
SC
d(on)
r
d(off)
f
GE(th)
GES
CE(sat)
on
off
CES
CEK
tot
ies
thJC
thJH
Gon
Conditions
T
T
T
V
RBSOA Clamped inductive load; L = 100 µH
V
T
T
Conditions
I
I
V
V
Inductive load
V
V
V
V
with heatsink compound
C
C
VJ
C
C
GE
VJ
C
CE
CE
CE
GE
CE
CE
CE
= 20 A; V
= 0.5 mA; V
= 25°C
= 90°C
= 25°C
= 25°C to 150°C
= 125°C; non-repetitive
= V
= V
= 0 V; V
= 300 V; I
= ± 15 V; R
= 25 V; V
= 300 V; V
= ± 15 V; R
CES
CES
; V
; V
GE
GE
GE
GE
GE
C
= 15 V
GE
= ± 20 V
GE
G
G
= ± 15 V; R
= 0 V
= 20 A
= 0 V; f = 1 MHz
= 47 Ω; T
= 47 Ω
= V
= 15 V; I
CE
C
G
VJ
= 20 A
= 47 Ω
T
T
T
T
T
= 125°C
VJ
VJ
VJ
VJ
VJ
(T
= 25°C
= 125°C
= 25°C
= 125°C
= 125°C
VJ
= 25°C, unless otherwise specified)
min.
4.5
Characteristic Values
Maximum Ratings
0.75
typ.
200
1.9
2.2
0.6
0.6
1.1
2.5
50
55
30
65
3
5
4
1
2
max.
± 20
1.25
V
600
100
200
2.4
6.5
0.6
CES
30
18
40
10
K/W
K/W
mA
mA
mJ
mJ
nC
nA
nF
µs
ns
ns
ns
ns
W
V
V
A
A
A
V
V
V
I
V
V
Features
• NPT IGBT technology
• HiPerFRED™ diode
• ISOPLUS i4-PAC™ package
Applications
• single phaseleg
• H bridge
• three phase bridge
C25
and heatsink
- low saturation voltage
- positive temperature coefficient for
- fast switching
- optimized fast and soft reverse
- low operating forward voltage
- low leakage current
- isolated back surface
- low coupling capacity between pins
- enlarged creepage towards heatsink
- application friendly pinout
- low inductive current path
- high reliability
- industry standard outline
- UL registered E 72873
- buck-boost chopper
- power supplies
- induction heating
- four quadrant DC drives
- controlled rectifier
- AC drives
- controlled rectifier
CES
CE(sat) typ.
recovery
easy paralleling
= 30 A
= 600 V
= 1.9 V
FII 30-06D
E72873
20110119a
1 - 5

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FII30-06D Summary of contents

Page 1

... MHz ies 300 Gon thJC R with heatsink compound thJH IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved Maximum Ratings 600 ± 125° Ω G 100 Characteristic Values (T = 25°C, unless otherwise specified) VJ min ...

Page 2

... pin - backside metal S A Weight IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved Maximum Ratings 600 30 15 Characteristic Values min. typ. max 25°C 2.3 2 125°C 1.6 ...

Page 3

... IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved FII 30-06D 20110119a ...

Page 4

... IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved 0.01 0 (s) FII 30-06D 0.005 IGBT 0 0.01 Z [K/W] thJH 0. 0.5 0.001 10 100 20110119a ...

Page 5

... T VJ Dynamic parameters versus T VJ 0.00001 0.0001 0.001 0.01 Transient thermal resistance junction to heatsink IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved 2000 T = 100° 300V nC R 1500 Q r 1000 I = 30A ...

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