RB521S30T1 ON Semiconductor, RB521S30T1 Datasheet - Page 3

DIODE SCHOTTKY 200MA 30V SOD523

RB521S30T1

Manufacturer Part Number
RB521S30T1
Description
DIODE SCHOTTKY 200MA 30V SOD523
Manufacturer
ON Semiconductor
Datasheet

Specifications of RB521S30T1

Voltage - Forward (vf) (max) @ If
500mV @ 200mA
Voltage - Dc Reverse (vr) (max)
30V
Current - Average Rectified (io)
200mA (DC)
Current - Reverse Leakage @ Vr
30µA @ 10V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Mounting Type
Surface Mount
Package / Case
SOD-523
Product
Schottky Diodes
Peak Reverse Voltage
30 V
Forward Continuous Current
0.2 A
Max Surge Current
1 A
Configuration
Single
Forward Voltage Drop
0.5 V
Maximum Reverse Leakage Current
30 uA at 10 V
Operating Temperature Range
- 55 C to + 125 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Reverse Recovery Time (trr)
-
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
 Details
Other names
RB521S30T1OS
RB521S30T1OS
RB521S30T1OSTR

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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
D
2 PL
0.08 (0.003)
J
1
M
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
T
X Y
A
S
K
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−X−
2
C
B
0.0547
SEATING
PLANE
−T−
1.40
−Y−
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
http://onsemi.com
0.0157
0.40
RB521S30T1
CASE 502−01
SOD−523
ISSUE B
3
SCALE 10:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
0.0157
1982.
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
0.40
DIM
A
B
C
D
J
K
S
inches
mm
MIN
1.10
0.70
0.50
0.25
0.07
0.15
1.50
MILLIMETERS
NOM
1.20
0.80
0.60
0.30
0.14
0.20
1.60
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MAX
1.30
0.90
0.70
0.35
0.20
0.25
1.70
0.0028
0.043
0.028
0.020
0.010
0.006
0.059
MIN
0.0055
INCHES
0.047
0.032
0.024
0.012
0.008
0.063
NOM
RB521S30T1/D
0.0079
0.051
0.035
0.028
0.014
0.010
0.067
MAX

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