BAT54LT1G ON Semiconductor, BAT54LT1G Datasheet - Page 3

• Manufacturer Part Number: BAT54LT1G
• Description: DIODE SCHOTTKY 30V DET/SW SOT23
• Manufacturer: ON Semiconductor

Specifications of BAT54LT1G

• Voltage - Forward (vf) (max) @ If: 800mV @ 100mA
• Voltage - Dc Reverse (vr) (max): 30V
• Current - Average Rectified (io): 200mA (DC)
• Current - Reverse Leakage @ Vr: 2µA @ 25V
• Diode Type: Schottky
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 5ns
• Capacitance @ Vr, F: 10pF @ 1V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Rectifier Type: Schottky Diode
• Configuration: Single
• Peak Rep Rev Volt: 30V
• Avg. Forward Curr (max): 0.2
• Rev Curr: 2uA
• Peak Non-repetitive Surge Current (max): 0.6A
• Forward Voltage: 0.8V
• Operating Temp Range: -55C to 125C
• Package Type: SOT-23
• Rev Recov Time: 5ns
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Product: Schottky Diodes
• Peak Reverse Voltage: 30 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 0.6 A
• Recovery Time: 5 ns
• Forward Voltage Drop: 0.8 V @ 0.1 A
• Maximum Reverse Leakage Current: 2 uA
• Operating Temperature Range: - 55 C to + 125 C
• Mounting Style: SMD/SMT
• Capacitance, Junction: 7.6 pF
• Current, Forward: 200 mA
• Power Dissipation: 200 mW
• Primary Type: Schottky Barrier
• Speed, Switching: Fast
• Temperature, Junction, Maximum: +125 °C
• Temperature, Operating: -55 to +125 °C
• Time, Recovery: 5 ns
• Voltage, Forward: 0.52 V
• Voltage, Reverse: 30 V
• Dc: 0546
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: BAT54LT1GOSTR

b
1
e
D
3
2
A1
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
H
A
E
0.037
0.95
L
0.035
0.9
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
0.031
0.8
SOT−23 (TO−236)
CASE 318−08
BAT54LT1
ISSUE AL
C
4
SCALE 10:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
0.037
0.95
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318−08.
STYLE 8:
PIN 1. ANODE
DIM
A1
H
A
b
D
E
c
e
L
E
0.079
inches
2. NO CONNECTION
3. CATHODE
2.0
mm
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.35
2.10
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.54
2.40
MAX
0.10
0.50
0.18
3.04
1.40
2.04
0.69
2.64
1.11
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.014
0.083
MIN
INCHES
0.040
0.002
0.018
0.005
0.051
0.075
0.021
0.094
NOM
0.114
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.029
0.104
MAX