BAS16,215 NXP Semiconductors, BAS16,215 Datasheet - Page 14

• Manufacturer Part Number: BAS16,215
• Description: DIODE SW 75V 215MA HS SOT23
• Manufacturer: NXP Semiconductors

Specifications of BAS16,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Voltage - Dc Reverse (vr) (max): 100V
• Current - Average Rectified (io): 215mA (DC)
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 4ns
• Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.215 A
• Max Surge Current: 4 A
• Configuration: Single
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.5 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Rectifier Type: Switching Diode
• Peak Rep Rev Volt: 100V
• Avg. Forward Curr (max): 0.215A
• Rev Curr: 0.5uA
• Peak Non-repetitive Surge Current (max): 4A
• Forward Voltage: 1.25V
• Operating Temp Range: -65C to 150C
• Package Type: TO-236AB
• Rev Recov Time: 4ns
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-1596-2; 933460620215; BAS16 T/R

NXP Semiconductors
BAS16_SER_5
Product data sheet
Fig 23. Reflow soldering footprint BAS16VV (SOT666)
Fig 24. Reflow soldering footprint BAS16VY (SOT363/SC-88)
2
1.7
1.075
2.35
Reflow soldering is the only recommended soldering method.
0.538
1.5
(4 )
0.6
0.55
(2 )
(4 )
0.5
Rev. 05 — 25 August 2008
0.45
(4 )
(4 )
0.5
(4 )
(4 )
0.5
0.6
2.65
1.8
2.75
2.45
2.1
1.6
1.7
(2 )
0.6
0.65
(2 )
(2 )
0.6
0.4 (2 )
(6 )
0.4
0.325
0.25
(2 )
(4 )
High-speed switching diodes
0.375
BAS16 series
(2 )
(4 )
0.3
Dimensions in mm
Dimensions in mm
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
solder paste
occupied area
sot363_fr
solder lands
placement area
solder paste
occupied area
sot666_fr
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