BAS16,235 NXP Semiconductors, BAS16,235 Datasheet - Page 12

• Manufacturer Part Number: BAS16,235
• Description: DIODE SW 85V 215MA HI-SPD SOT-23
• Manufacturer: NXP Semiconductors

Specifications of BAS16,235

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Voltage - Dc Reverse (vr) (max): 100V
• Current - Average Rectified (io): 215mA (DC)
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 4ns
• Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.215 A
• Max Surge Current: 4 A
• Configuration: Single
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.5 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 933460620235; BAS16 /T3; BAS16 /T3

NXP Semiconductors
BAS16_SER_5
Product data sheet
Fig 19. Reflow soldering footprint BAS16H (SOD123F)
Fig 20. Reflow soldering footprint BAS16J (SOD323F)
1.65
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering is the only recommended soldering method.
0.95
1.6
(2 )
(2 )
0.5
0.6
(2 )
1.1
Rev. 05 — 25 August 2008
3.05
2.2
2.1
4.4
2.9
1.6
4
0.5 (2 )
1.1 1.2
0.6 (2 )
High-speed switching diodes
BAS16 series
Dimensions in mm
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
solder paste
occupied area
solder lands
solder resist
solder paste
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