HFA25PB60PBF Vishay, HFA25PB60PBF Datasheet - Page 2

• Manufacturer Part Number: HFA25PB60PBF
• Description: DIODE HEXFRED 600V 25A TO247AC
• Manufacturer: Vishay
• Series: HEXFRED®r

Specifications of HFA25PB60PBF

• Diode Type: Standard
• Voltage - Forward (vf) (max) @ If: 1.7V @ 25A
• Voltage - Dc Reverse (vr) (max): 600V
• Current - Average Rectified (io): 25A
• Current - Reverse Leakage @ Vr: 20µA @ 600V
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 75ns
• Mounting Type: Through Hole, Radial
• Package / Case: TO-247-2 (TO-247AC Modified)
• Product: Ultra Fast Recovery Rectifier
• Configuration: Single
• Reverse Voltage: 600 V
• Forward Voltage Drop: 2 V @ 50 A
• Recovery Time: 75 ns
• Forward Continuous Current: 25 A
• Max Surge Current: 225 A
• Reverse Current Ir: 20 uA
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Repetitive Reverse Voltage Vrrm Max: 600V
• Forward Current If(av): 25A
• Forward Voltage Vf Max: 2V
• Reverse Recovery Time Trr Max: 75ns
• Forward Surge Current Ifsm Max: 225A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: *HFA25PB60PBF; VS-HFA25PB60PBF; VS-HFA25PB60PBF; VSHFA25PB60PBF; VSHFA25PB60PBF

HFA25PB60PbF
Vishay High Power Products
www.vishay.com
2
ELECTRICAL SPECIFICATIONS (T
PARAMETER
Cathode to anode
breakdown voltage
Maximum forward voltage
Maximum reverse
leakage current
Junction capacitance
Series inductance
DYNAMIC RECOVERY CHARACTERISTICS (T
PARAMETER
Reverse recovery time
See fig. 5, 10
Peak recovery current
See fig. 6, 10
Reverse recovery charge
See fig. 7, 10
Peak rate of fall of recovery
current during t
See fig. 8, 10
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Lead temperature
Thermal resistance,
junction to case
Thermal resistance,
junction to ambient
Thermal resistance,
case to heatsink
Weight
Mounting torque
Marking device
b
dI
dI
SYMBOL
SYMBOL
SYMBOL
(rec)M
(rec)M
I
I
R
R
R
T
V
V
RRM1
RRM2
Q
Q
I
C
L
t
t
RM
thCS
t
lead
thJC
thJA
rr1
rr2
FM
BR
rr
S
rr1
rr2
T
For technical questions, contact: [e-mail]
/dt1
/dt2
I
I
I
I
V
T
V
Measured lead to lead 5 mm from package body
I
T
T
T
T
T
T
T
T
0.063" from case (1.6 mm) for 10 s
Typical socket mount
Mounting surface, flat, smooth and greased
Case style TO-247AC modified (JEDEC)
R
F
F
F
F
Ultrafast Soft Recovery Diode, 25 A
J
R
R
J
J
J
J
J
J
J
J
= 25 A
= 50 A
= 25 A, T
= 100 µA
= 1.0 A, dI
= 125 °C, V
J
= 25 °C
= 125 °C
= 25 °C
= 125 °C
= 25 °C
= 125 °C
= 25 °C
= 125 °C
= V
= 200 V
= 25 °C unless otherwise specified)
R
rated
J
TEST CONDITIONS
TEST CONDITIONS
TEST CONDITIONS
= 125 °C
F
/dt = 200 A/µs, V
R
= 0.8 x V
HEXFRED
J
= 25 °C unless otherwise specified)
I
dI
V
R
F
R
F
= 25 A
rated
/dt = 200 A/µs
= 200 V
R
= 30 V
®
See fig. 1
See fig. 2
See fig. 3
MIN.
MIN.
(5.0)
MIN.
600
6.0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP.
TYP.
TYP.
0.25
0.21
105
112
420
250
160
600
4.5
8.0
6.0
1.3
1.5
1.3
1.5
23
50
55
12
HFA25PB60
-
-
-
-
-
Document Number: 94064
MAX.
MAX.
MAX.
1200
2000
Revision: 25-Jul-08
0.83
(10)
160
375
300
100
1.7
2.0
1.7
40
12
20
75
10
15
-
-
-
-
-
-
-
-
kgf · cm
(lbf · in)
UNITS
UNITS
UNITS
A/µs
K/W
nC
oz.
µA
pF
nH
°C
ns
V
A
g