BAS70,215 NXP Semiconductors, BAS70,215 Datasheet - Page 13

• Manufacturer Part Number: BAS70,215
• Description: DIODE SCHOTTKY 70V 70MA SOT23
• Manufacturer: NXP Semiconductors

Specifications of BAS70,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1V @ 15mA
• Voltage - Dc Reverse (vr) (max): 70V
• Current - Average Rectified (io): 70mA (DC)
• Current - Reverse Leakage @ Vr: 10µA @ 70V
• Diode Type: Schottky
• Speed: Small Signal =< 200mA (Io), Any Speed
• Capacitance @ Vr, F: 2pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 70 V
• Forward Continuous Current: 0.07 A
• Max Surge Current: 0.1 A
• Configuration: Single
• Forward Voltage Drop: 1 V @ 0.015 A
• Maximum Reverse Leakage Current: 10 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Rectifier Type: Schottky Diode
• Peak Rep Rev Volt: 70V
• Avg. Forward Curr (max): 0.07A
• Rev Curr: 10uA
• Peak Non-repetitive Surge Current (max): 0.1A
• Forward Voltage: 1V
• Operating Temp Range: -65C to 150C
• Package Type: TO-236AB
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-1608-2; 934020790215; BAS70 T/R

NXP Semiconductors
BAS70_1PS7XSB70_SER_9
Product data sheet
Fig 19. Reflow soldering footprint SOD123F
Fig 20. Reflow soldering footprint SOD882
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.6
R = 0.05 (8×)
solder lands
solder resist
occupied area
solder paste
BAS70 series; 1PS7xSB70 series
(2×)
1.1
Rev. 09 — 13 January 2010
0.90
4.4
2.9
1.6
4
0.30
0.40
0.50
(2×)
(2×)
(2×)
0.30
1.30
1.1 1.2
General-purpose Schottky diodes
R = 0.05 (8×)
0.60
(2×)
0.70
(2×)
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
mbl872
0.80
(2×)
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