RB751S40T1G ON Semiconductor, RB751S40T1G Datasheet - Page 3

DIODE SCHOTTKY 30MA 40V SOD523

RB751S40T1G

Manufacturer Part Number
RB751S40T1G
Description
DIODE SCHOTTKY 30MA 40V SOD523
Manufacturer
ON Semiconductor
Datasheet

Specifications of RB751S40T1G

Voltage - Forward (vf) (max) @ If
370mV @ 1mA
Voltage - Dc Reverse (vr) (max)
30V
Current - Average Rectified (io)
30mA (DC)
Current - Reverse Leakage @ Vr
500nA @ 30V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Capacitance @ Vr, F
2.5pF @ 1V, 1MHz
Mounting Type
Surface Mount
Package / Case
SOD-523
Product
Schottky Diodes
Peak Reverse Voltage
40 V
Forward Continuous Current
0.03 A
Max Surge Current
0.5 A
Configuration
Single
Forward Voltage Drop
0.37 V @ 0.001 A
Maximum Reverse Leakage Current
0.5 uA
Operating Temperature Range
- 55 C to + 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
RB751S40T1GOS
RB751S40T1GOS
RB751S40T1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
RB751S40T1G
Manufacturer:
ON Semiconductor
Quantity:
72 418
Part Number:
RB751S40T1G
Manufacturer:
ON Semiconductor
Quantity:
25
Part Number:
RB751S40T1G
Manufacturer:
ON
Quantity:
30 000
Part Number:
RB751S40T1G
Manufacturer:
ST
0
Part Number:
RB751S40T1G
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
RB751S40T1G
Quantity:
30 000
Company:
Part Number:
RB751S40T1G
Quantity:
66 000
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
 Literature Distribution Center for ON Semiconductor
 P . O. Box 5163, Denver, Colorado 80217 USA
  Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
  Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
  Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
D
2 PL
0.08 (0.003)
J
1
M
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
T
X Y
A
S
K
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
-X-
2
C
B
SEATING
PLANE
-T-
-Y-
0.0547
1.40
N. American Technical Support: 800-282-9855 Toll Free
 USA/Canada
Europe, Middle East and Africa Technical Support:
 Phone: 421 33 790 2910
Japan Customer Focus Center
 Phone: 81-3-5773-3850
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
http://onsemi.com
RB751S40T1
CASE 502-01
0.0157
0.40
SOD-523
ISSUE C
3
SCALE 10:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
1982.
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
DIM
0.0157
A
B
C
D
K
S
J
0.40
MIN
1.10
0.70
0.50
0.25
0.07
0.15
1.50
inches
mm
MILLIMETERS
NOM
1.20
0.80
0.60
0.30
0.14
0.20
1.60
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.30
0.90
0.70
0.35
0.20
0.25
1.70
0.0028
0.043
0.028
0.020
0.010
0.006
0.059
MIN
INCHES
0.0055
0.047
0.032
0.024
0.012
0.008
0.063
NOM
RB751S40T1/D
0.0079
0.051
0.035
0.028
0.014
0.010
0.067
MAX

Related parts for RB751S40T1G