G3VM-61E Omron, G3VM-61E Datasheet - Page 4
![MOSFET SMT Relay](/photos/9/55/95581/39-6-dip-smt_sml.jpg)
G3VM-61E
Manufacturer Part Number
G3VM-61E
Description
MOSFET SMT Relay
Manufacturer
Omron
Series
G3VMr
Specifications of G3VM-61E
Circuit
SPST-NO (1 Form A)
Output Type
AC, DC
On-state Resistance
2 Ohm
Load Current
500mA
Voltage - Input
1.15VDC
Voltage - Load
0 ~ 60 V
Mounting Type
Surface Mount
Termination Style
Gull Wing
Package / Case
6-SMD (300 mil)
Control Voltage Range
1 V to 1.3 V
Load Voltage Rating
60 V
Off State Leakage Current (max)
1 uA
Load Current Rating
500 mA
Contact Form
1 Form A
Output Device
MOSFET
Mounting Style
SMD/SMT
Relay Type
MOSFET Relay
Turn-on Switching
FET
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
G3VM61E
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
G3VM-61E
Manufacturer:
OMRON/欧姆龙
Quantity:
20 000
Company:
Part Number:
G3VM-61E1
Manufacturer:
WINBOND
Quantity:
320
Company:
Part Number:
G3VM-61ER
Manufacturer:
OMRON
Quantity:
12 000
Company:
Part Number:
G3VM-61ER(TR)
Manufacturer:
OMRON
Quantity:
12 000
■ Solder Mounting
Perform solder mounting under the following recommended conditions
to prevent the temperature of the relays from rising, causing possible
damage to the relays.
Flow Soldering
Through Hole Packages (Once only)
Note: It is recommended that the suitability of solder mounting be
Reflow Soldering
Surface Mount Packages (Twice max.)
*Measured from the top surface of the relay package
Note: 1. It is recommended that the suitability of solder mounting be
Manual Soldering (Once only)
Manually solder at 350°C for 3s or less or at 260°C for 10s or less.
4
Lead solder
(SnPb)
Lead-free solder
(SnAgCu)
Lead solder
(SnPb)
Lead-free solder
(SnAgCu)
Solder type
Solder type
verified under actual conditions
2. Tape cut SSOP’s are packaged without humidity resistance.
verified under actual conditions
Use manual soldering to mount them.
MOS FET Relays
140 to 160°C,
60 to 120s
180 to 190°C,
60 to 120s
150°C,
60 to 120s
150°C,
60 to 120s
Temperature*
Temperature
Preheating
Preheating
260°C,
10s max.
260°C,
10s max.
210°C,
30s max.
230°C,
30 to 50s
Technical Information
Temperature*
Temperature
Soldering
Solder
Peak,
240°C max.
Peak,
260°C max.
SSOP Handling Precautions
Humidity-resistant Packaging
Component cases can crack if surface-mounted components that
have absorbed moisture are subjected to thermal stress when
mounting. To prevent this, observe the following precautions.
1. Unopened components can be stored in the packaging at
2. After the packaging has been opened, components can be
3. If, after opening the packaging, the humidity indicator turns
4. If the same components are baked repeatedly, then the tape
5. When mounting using dehumidifying measures, always take
6. Do not throw or drop the components. If the laminated pack-
7. Tape cut SSOP’s are packaged without humidity resistance.
5 to 30°C and a humidity of 90% max. However, they should
be used within 12 months.
stored at 5 to 30°C and a humidity of 70% max. However, they
should be mounted within 168 hours.
pink to the 30% mark or the expiration date is exceeded, then
bake the components while they are still on the taping reel
and use them within 72 hours. Do not bake the same compo-
nents more than once.
detachment strength will change, causing potential problems
when mounting. Use caution when mounting under these
conditions.
countermeasures against component damage from static
electricity.
aging material is damaged, airtightness will be lost.
Use manual soldering to mount them.
Baking conditions: 60 ± 5°C, 64 to 72 hours