MURHB860CTT4 ON Semiconductor, MURHB860CTT4 Datasheet
MURHB860CTT4
Specifications of MURHB860CTT4
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MURHB860CTT4 Summary of contents
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... MURHB860CTG ° −65 to +175 J stg MURHB860CTT4 MURHB860CTT4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. 1 http://onsemi ...
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THERMAL CHARACTERISTICS (Per Leg) Maximum Thermal Resistance, Junction−to−Case Maximum Thermal Resistance, Junction−to−Ambient ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (Note 4 150° 4 25° Maximum ...
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... PL 0.13 (0.005 VARIABLE CONFIGURATION ZONE VIEW W−W VIEW W−W 1 10.66 0.42 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MURHB860CT PACKAGE DIMENSIONS 2 D PAK 3 CASE 418B−04 ISSUE ...
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... Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com MURHB860CT N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 ON Semiconductor Website: http://onsemi ...