DSA20C150PN IXYS, DSA20C150PN Datasheet - Page 2
![no-image](/images/manufacturer_photos/0/3/352/ixys_sml.jpg)
DSA20C150PN
Manufacturer Part Number
DSA20C150PN
Description
DIODE SCHTKY 150V2X10A TO220FPAB
Manufacturer
IXYS
Datasheet
1.DSA20C150PN.pdf
(2 pages)
Specifications of DSA20C150PN
Voltage - Forward (vf) (max) @ If
880mV @ 10A
Current - Reverse Leakage @ Vr
300µA @ 150V
Current - Average Rectified (io) (per Diode)
10A
Voltage - Dc Reverse (vr) (max)
150V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Configuration
1 Pair Common Cathode
Mounting Type
Through Hole
Package / Case
TO-220AB Full Pack
Vrrm, (v)
150
Ifavm, D = 0.5, Total, (a)
20
Ifavm, D = 0.5, Per Diode, (a)
10
@ Tc, (°c)
140
Vf, Max, Tvj =125°c, (v)
0.74
@ If, (a)
10
Tvjm, (°c)
175
Rthjc, Max, (k/w)
4.50
Package Style
TO-220ABFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSA20C150PN
Manufacturer:
IXYS
Quantity:
18 000
Symbol
I
R
M
F
* Irms is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.
IXYS reserves the right to change limits, conditions and dimensi
© 2005 IXYS all rights reserved
T
Weight
Outlines TO-220FPAB
RMS
In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting
the backside.
thCH
D
C
stg
Q
L1
b1
Definition
RMS current
thermal resistance case to heatsink
mounting torque
mounting force with clip
storage temperature
E
e
b
ØP
D
L
H
Data according to IEC 60747and per diode unless otherwise specified
A
Conditions
per pin*
c
A1
A2
DSA 20 C 150PN
min.
0.4
-55
20
Ratings
typ.
0.50
2
max.
150
0.6
advanced
35
60
Unit
K/W
Nm
°C
N
A
g