LTC3407EMSE-2 Linear Technology, LTC3407EMSE-2 Datasheet - Page 15

• Manufacturer Part Number: LTC3407EMSE-2
• Description: IC,SMPS CONTROLLER,CURRENT-MODE,CMOS,TSSOP,10PIN,PLASTIC
• Manufacturer: Linear Technology

PACKAGE DESCRIPTIO
3.50 ±0.05
2.15 ±0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
TOP MARK
0.25 ± 0.05
1.65 ±0.05
(2 SIDES)
PIN 1
0.200 REF
U
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
10-Lead Plastic DFN (3mm × 3mm)
2.38 ±0.05
(2 SIDES)
(Reference LTC DWG # 05-08-1699)
0.50
BSC
DD Package
0.675 ±0.05
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5
R = 0.115
6
2.38 ±0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 ± 0.05
0.38 ± 0.10
(DD10) DFN 1103
LTC3407-3
15
34073fa