TISP61060P Bourns Inc., TISP61060P Datasheet - Page 13

• Manufacturer Part Number: TISP61060P
• Description: Sidacs
• Manufacturer: Bourns Inc.

Specifications of TISP61060P

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

P008
plastic dual-in-line package
NOTES: A. Each pin centreline is located within 0,25 (0.010) of its true longitudinal position.
SEPTEMBER 1995 - REVISED AUGUST 2002
Specifications are subject to change without notice.
P R O D U C T
P008
Notch
Index
This dual-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions The package is intended for
insertion in mounting-hole rows on 7,62 (0.300) centers. Once the leads are compressed and inserted,
sufficient tension is provided to secure the package in the board during soldering.
additional cleaning or processing when used in soldered assembly.
B. Dimensions fall within JEDEC MS001 - R-PDIP-T, 0.300" Dual-In-Line Plastic Family.
C. Details of the previous dot index P008 package style, drawing reference MDXXABA, are given in the earlier publications.
0,53 (0.021)
0,38 (0.015)
8 Places
1
8
9,75 (0.384)
9,25 (0.364)
7
2
ALL LINEAR DIMENSIONS IN MILLIMETERS AND PARANTHETICALLY IN INCHES
I N F O R M A T I O N
6
3
1,78 (0.070) MAX
4 Places
5
4
0,51 (0.020)
2,54 (0.100) Typical
MIN
6,60 (0.260)
6,10 (0.240)
(see Note A)
6 Places
MECHANICAL DATA
DUAL FORWARD-CONDUCTING P-GATE THYRISTORS
5,08 (0.200)
3,17 (0.125)
PROGRAMMABLE OVERVOLTAGE PROTECTORS
MAX
MIN
Seating
Plane
TISP61060D, TISP61060P
0,36 (0.014)
0,20 (0.008)
8,23 (0.324)
7,62 (0.300)
9,40 (0.370)
8,38 (0.330)
Leads require no
MDXXCF
13