TSMBJ1010C/TP Micro Commercial Components (MCC), TSMBJ1010C/TP Datasheet - Page 3

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TSMBJ1010C/TP

Manufacturer Part Number
TSMBJ1010C/TP
Description
Sidacs 140V 100A
Manufacturer
Micro Commercial Components (MCC)
Datasheet

Specifications of TSMBJ1010C/TP

Breakover Current Ibo Max
50 A
Rated Repetitive Off-state Voltage Vdrm
140 V
Off-state Leakage Current @ Vdrm Idrm
0.005 mA
Forward Voltage Drop
5 V
Mounting Style
SMD/SMT
Package / Case
DO-214
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Revision: 4
Micro Commercial Components
Features
Mechanical Data
Maximum Rating
Thermal Resistance
Non-repetitive peak
impulse current
Non-repetitive peak
On-state current
Operating temperature
range
Junction and storage
temperature range
Characteristic
Thermal Resistance
junction to lead
Thermal Resistance
junction to ambient
Typical positive
temperature
coefficient for
breakdown voltage
M C C
Oxide-Glass passivated Junction
Bi-Directional protection in a single device
Surge capabilities up to 100A@10/1000us or 400A@8/20us
High Off-State impedance and Low On-State voltage
Plastic material has UL flammability classification 94V -0
Case
Polarity : None cathode band denotes
Approx Weight : 0.093grams
Characteristic
: Molded plastic
Symbol
Symbol
T
V
R
R
J
BR
I
, T
T
q
I
TSM
q
PP
OP
www.mccsemi.com
JA
JL
/ T
STG
TM
J
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
-40~150
-55~150
100
0.1%/
20
Value
Value
100A
50A
o
C/W
o
C/W
o
C
o
o
C
C
8.3ms, one-half
cycle
10/1000us
On recommended
pad layout
Unit
Unit
DIM
A
B
C
D
E
F
G
H
J
Protection Device
Transient Voltage
INCHES
TSMBJ1006C
TSMBJ1024C
75 to 320 Volts
G
.078
.077
.030
.065
.205
.160
.130
MIN
.002
F
H
---
SUGGESTED SOLDER
E
DO-214AA
THRU
MAX
.008
.096
.083
.060
.091
.220
.180
.155
.02
PAD LAYOUT
0.085”
(SMBJ)
DIMENSIONS
0.090"
J
MIN
2.00
1.96
1.65
5.21
4.06
3.30
.76
.05
---
A
MM
D
MAX
2.44
2.10
1.52
2.32
5.59
4.57
3.94
.20
.51
0.070”
200 5/01/10
B
NOTE
C

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