BAT54A-TP Micro Commercial Components (MCC), BAT54A-TP Datasheet - Page 2

• Manufacturer Part Number: BAT54A-TP
• Description: DIODE SCHOTTKY 30V 200MA SOT23
• Manufacturer: Micro Commercial Components (MCC)

Specifications of BAT54A-TP

• Voltage - Forward (vf) (max) @ If: 1V @ 100mA
• Current - Reverse Leakage @ Vr: 2µA @ 25V
• Current - Average Rectified (io) (per Diode): 200mA (DC)
• Voltage - Dc Reverse (vr) (max): 30V
• Reverse Recovery Time (trr): 5ns
• Diode Type: Schottky
• Speed: Small Signal =< 200mA (Io), Any Speed
• Diode Configuration: 1 Pair Common Anode
• Mounting Type: Surface Mount
• Package / Case: SOT-23
• Product: Schottky Diodes
• Peak Reverse Voltage: 30 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 0.6 A
• Configuration: Dual Common Anode
• Recovery Time: 5 ns
• Forward Voltage Drop: 1 V at 0.1 A
• Maximum Reverse Leakage Current: 2 uA at 25 V
• Operating Temperature Range: - 55 C to + 125 C
• Mounting Style: SMD/SMT
• Capacitance, Junction: 10 pF
• Current, Forward: 200 mA
• Current, Reverse: 2 μA
• Current, Surge: 0.6 A
• Package Type: SOT-23
• Power Dissipation: 200 mW
• Primary Type: Schottky Barrier
• Temperature, Junction, Maximum: +125 °C
• Temperature, Operating: -55 to +125 °C
• Time, Recovery: 5 ns
• Voltage, Forward: 1000 mV
• Voltage, Reverse: 30 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: BAT54ATPMSTR

Micro Commercial Components
Features
•
•
BAT54
BAT54A
BAT54C
BAT54S
Maximum Ratings
Continuos Reverse Voltage
Forward ContinuousCurrent
Non-Repetitive Peak Forward Current t<1s
Total Power Dissipation @ T
Storage Temperature Range
Operating Junction Temperature Range
Soldering temperature during 10s
Electrical Characteristics @ 25 °C Unless Otherwise Specified
Forward Voltage at
Reverse Current
Capacitance
Reverse Recovery
Time
Thermal Resistance,
Junction to Ambient
MCC Catalog
Characteristics
M C C
Case Material: Molded Plastic. UL Flammability
Low Forward Voltage
Surface Mount device
Classification Rating 94V-0 and MSL Rating 1
Number
I
I
I
I
I
F
F
F
F
F
= 0.1mA
= 1mA
= 10mA
= 30mA
= 100mA
KL2
KL1
KL3
KL4
Device Marking
1
Symbol
R
V
C
I
t
A
θJA
R
rr
TM
F
J
= 25°C
L42
L43
L44
L4
2
500
1000mV
240mV
320mV
400mV
500mV
2.0 uA
10pF
Max.
5nS
°C/W
Single
Dual
Dual
Dual
Type
I
T
P
V
FSM
T
T
I
stg
F
R
D
j
Measured at
1.0MHz, V
I
I
F
(REC)
V
=I
R
R
= 25V
-55°C to 150°C
-55°C to 125°C
=10mA;
Configuration
= 1mA
See page 3
Figure 1
Figure
Figure 3
Figure 4
Notes
200mW
260°C
200mA
1 of 3
0.6A
Pin
30V
R
=1.0V
2
G
DIM
Schottky Barrier Diode
C
D
G
A
B
E
F
H
K
J
200mWatt, 30Volt
F
K
INCHES
.0005
.110
.083
.047
.035
.070
.018
.035
.003
.015
MIN
.035
.900
A
E
. 037
.950
Suggested Solder
D
BAT54S
BAT54
. 031
.800
THRU
SOT-23
.0039
MAX
.120
.098
.055
.041
.081
.024
.044
.007
.020
Pad Layout
DIMENSIONS
.950
.037
H
C
B
2.80
2.10
1.20
MIN
1.78
.013
.085
.89
.45
.89
.37
MM
.079
2.000
J
MAX
3.04
2.64
1.40
1.03
2.05
.100
1.12
.180
.60
.51
in ches
mm
NOTE