MBRP20045CT ON Semiconductor, MBRP20045CT Datasheet
MBRP20045CT
Specifications of MBRP20045CT
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MBRP20045CT Summary of contents
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... POWERTAP II CASE 357C PLASTIC MARKING DIAGRAM MCC AYYWWG B20045T B20045T = Specific Device Code MCC = Mold Compound Code A = Assembly Location YY = Year WW = York Week G = Pb−Free Package ORDERING INFORMATION Device Package Shipping POWERTAP II 25 Units/Tray POWERTAP II 25 Units/Tray (Pb−Free) Publication Order Number: MBRP20045CT/D ...
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THERMAL CHARACTERISTICS (Per Leg) Thermal Resistance, Junction−to−Case ELECTRICAL CHARACTERISTICS Instantaneous Forward Voltage (Note 200 Amps 25° 200 Amps 125° Instantaneous Reverse Current (Note 1) (Rated dc Voltage, ...
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The POWERTAP package requires special mounting considerations because of the long longitudinal axis of the copper heat sink important to follow the proper tightening sequence to avoid warping the heat sink, which can reduce thermal contact between the ...
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... Q 0.270 0.285 6.86 7.23 R 31.50 BSC 80.01 BSC U 0.600 0.630 15.24 16.00 V 0.330 0.375 8.39 9.52 W 0.170 0.190 4.32 4.82 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MBRP20045CT/D ...