MLX90333LDC-BCH Melexis Inc, MLX90333LDC-BCH Datasheet - Page 41

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MLX90333LDC-BCH

Manufacturer Part Number
MLX90333LDC-BCH
Description
IC 3D-JOYSTICK POS SENSOR 8-SOIC
Manufacturer
Melexis Inc
Datasheet

Specifications of MLX90333LDC-BCH

Sensor Type
3D
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 150°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MLX90333LDC
MLX90333LDC
Q4656097

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MLX90333LDC-BCH-000
Manufacturer:
MELEXIS/迈来芯
Quantity:
20 000
18.
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
Iron Soldering THD’s (Through Hole Devices)
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance
of adhesive strength between device and board.
For more information on the lead free topic please see quality page at our website:
http://www.melexis.com/quality.aspx
19.
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
3901090333
Rev. 003
products with different soldering processes
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(Classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(Reflow profiles according to table 2)
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
Standard information regarding manufacturability of Melexis
ESD Precautions
Page 41 of 46
Tria ⊗ is ™ Position Sensor
MLX90333
Data Sheet
Feb. 11

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