HIN236CP Intersil, HIN236CP Datasheet - Page 17

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HIN236CP

Manufacturer Part Number
HIN236CP
Description
RS232 5V 4D/3R 1UF CAPS 24PDIP
Manufacturer
Intersil
Datasheets
Small Outline Plastic Packages (SOIC)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
-C-
E
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
-B-
B S
A
17
H
A1
µ
α
0.10(0.004)
0.25(0.010)
M
L
h x 45
B
M
o
C
M24.3
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
C
D
H
N
α
A
B
E
e
h
L
(JEDEC MS-013-AD ISSUE C)
0.0926
0.0040
0.013
0.0091
0.5985
0.2914
0.394
0.010
0.016
MIN
0
o
0.05 BSC
INCHES
24
0.1043
0.0118
0.020
0.0125
0.6141
0.2992
0.419
0.029
0.050
MAX
8
o
15.20
10.00
MILLIMETERS
2.35
0.10
0.33
0.23
7.40
0.25
0.40
MIN
0
o
1.27 BSC
24
15.60
10.65
MAX
2.65
0.30
0.51
0.32
7.60
0.75
1.27
8
o
Rev. 0 12/93
NOTES
9
3
4
5
6
7
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