CY7C1474V25-200BGI Cypress Semiconductor Corp, CY7C1474V25-200BGI Datasheet - Page 12
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CY7C1474V25-200BGI
Manufacturer Part Number
CY7C1474V25-200BGI
Description
CY7C1474V25-200BGI
Manufacturer
Cypress Semiconductor Corp
Datasheet
1.CY7C1470V25-200BZXC.pdf
(31 pages)
Specifications of CY7C1474V25-200BGI
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
72M (1M x 72)
Speed
200MHz
Interface
Parallel
Voltage - Supply
2.375 V ~ 2.625 V
Operating Temperature
-40°C ~ 85°C
Package / Case
209-FBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY7C1474V25-200BGI
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
IEEE 1149.1 Serial Boundary Scan (JTAG)
The
incorporates a serial boundary scan test access port (TAP). This
port operates in accordance with IEEE Standard 1149.1-1990
but does not have the set of functions required for full 1149.1
compliance. These functions from the IEEE specification are
excluded because their inclusion places an added delay in the
critical speed path of the SRAM. Note that the TAP controller
functions in a manner that does not conflict with the operation of
other devices using 1149.1 fully compliant TAPs. The TAP
operates using JEDEC-standard 2.5 V or 1.8 V I/O logic levels.
The CY7C1470V25/CY7C1472V25/CY7C1474V25 contains a
TAP controller, instruction register, boundary scan register,
bypass register, and ID register.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(V
internally pulled up and may be unconnected. They may
alternately be connected to V
should be left unconnected. Upon power-up, the device will
come up in a reset state which will not interfere with the operation
of the device.
TAP Controller State Diagram
The 0/1 next to each state represents the value of TMS at the
rising edge of TCK.
Test Access Port (TAP)
Test Clock (TCK)
The test clock is used only with the TAP controller. All inputs are
captured on the rising edge of TCK. All outputs are driven from
the falling edge of TCK.
Document Number: 38-05290 Rev. *L
SS
1
0
) to prevent clocking of the device. TDI and TMS are
TEST-LOGIC
RUN-TEST/
RESET
IDLE
0
1
CY7C1470V25/CY7C1472V25/CY7C1474V25
1
0
CAPTURE-DR
UPDATE-DR
PAUSE-DR
DR-SCAN
SHIFT-DR
EXIT1-DR
EXIT2-DR
1
SELECT
0
0
1
0
1
1
DD
0
through a pull-up resistor. TDO
1
1
0
0
1
0
CAPTURE-IR
UPDATE-IR
PAUSE-IR
EXIT1-IR
EXIT2-IR
1
IR-SCAN
SHIFT-IR
SELECT
0
0
1
0
1
1
0
1
1
0
0
Test MODE SELECT (TMS)
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. It is allowable to leave
this ball unconnected if the TAP is not used. The ball is pulled up
internally, resulting in a logic HIGH level.
Test Data-In (TDI)
The TDI ball is used to serially input information into the registers
and can be connected to the input of any of the registers. The
register between TDI and TDO is chosen by the instruction that
is loaded into the TAP instruction register. For information on
loading the instruction register, see the TAP Controller State
Diagram. TDI is internally pulled up and can be unconnected if
the TAP is unused in an application. TDI is connected to the most
significant bit (MSB) of any register. (See
Diagram.)
Test Data-Out (TDO)
The TDO output ball is used to serially clock data-out from the
registers. The output is active depending upon the current state
of the TAP state machine. The output changes on the falling edge
of TCK. TDO is connected to the least significant bit (LSB) of any
register. (See
TAP Controller Block Diagram
Performing a TAP Reset
A RESET is performed by forcing TMS HIGH (V
edges of TCK. This RESET does not affect the operation of the
SRAM and may be performed while the SRAM is operating.
At power-up, the TAP is reset internally to ensure that TDO
comes up in a high Z state.
TAP Registers
Registers are connected between the TDI and TDO balls and
allow data to be scanned into and out of the SRAM test circuitry.
Only one register can be selected at a time through the
instruction register. Data is serially loaded into the TDI ball on the
rising edge of TCK. Data is output on the TDO ball on the falling
edge of TCK.
TMS
TCK
TDI
Selection
Circuitry
TAP Controller State
Boundary Scan Register
Identification Register
31
x
Instruction Register
TAP CONTROLLER
30
.
Bypass Register
29
.
.
.
.
.
.
.
2
2
2
Diagram.)
1
1
1
0
0
0
0
CY7C1470V25
CY7C1472V25
CY7C1474V25
TAP Controller Block
S
Circuitr
election
DD
y
Page 12 of 31
) for five rising
TDO
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