CY7C1354CV25-166BZCT Cypress Semiconductor Corp, CY7C1354CV25-166BZCT Datasheet - Page 19
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CY7C1354CV25-166BZCT
Manufacturer Part Number
CY7C1354CV25-166BZCT
Description
CY7C1354CV25-166BZCT
Manufacturer
Cypress Semiconductor Corp
Datasheet
1.CY7C1354CV25-200AXC.pdf
(30 pages)
Specifications of CY7C1354CV25-166BZCT
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
9M (256K x 36)
Speed
166MHz
Interface
Parallel
Voltage - Supply
2.375 V ~ 2.625 V
Operating Temperature
0°C ~ 70°C
Package / Case
165-LFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY7C1354CV25-166BZCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Capacitance
Thermal Resistance
AC Test Loads and Waveforms
Note
Document Number: 38-05537 Rev. *K
C
C
C
Θ
Θ
19. Tested initially and after any design or process change that may affect these parameters.
Parameters
Parameter
IN
CLK
I/O
JA
JC
2.5V I/O Test Load
OUTPUT
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Input capacitance
Clock input capacitance
Input/output capacitance
Z
0
[19]
= 50Ω
Description
Description
(a)
V
T
= 1.25V
[19]
R
L
= 50Ω
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA/JESD51.
OUTPUT
2.5V
INCLUDING
Test Conditions
JIG AND
V
SCOPE
DD
T
A
Test Conditions
= 2.5 V, V
= 25 °C, f = 1 MHz,
5 pF
(b)
DDQ
R = 1667Ω
= 2.5 V
R = 1538Ω
100 TQFP
Package
29.41
6.13
100 TQFP
V
Max
GND
DDQ
5
5
5
≤ 1 ns
10%
119 BGA
Package
119 BGA
34.1
14
ALL INPUT PULSES
Max
5
5
7
90%
(c)
CY7C1354CV25
CY7C1356CV25
165 FBGA
165 FBGA
Package
16.8
Max
3.0
5
5
7
90%
10%
Page 19 of 30
≤ 1 ns
°C/W
°C/W
Unit
Unit
pF
pF
pF
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