CY7C1354C-166BGC Cypress Semiconductor Corp, CY7C1354C-166BGC Datasheet - Page 31
![IC,SYNC SRAM,256KX36,CMOS,BGA,119PIN,PLASTIC](/photos/28/21/282110/119-bga_sml.jpg)
CY7C1354C-166BGC
Manufacturer Part Number
CY7C1354C-166BGC
Description
IC,SYNC SRAM,256KX36,CMOS,BGA,119PIN,PLASTIC
Manufacturer
Cypress Semiconductor Corp
Datasheet
1.CY7C1354C-166AXC.pdf
(32 pages)
Specifications of CY7C1354C-166BGC
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
9M (256K x 36)
Speed
166MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
119-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY7C1354C-166BGC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1354C-166BGC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Company:
Part Number:
CY7C1354C-166BGCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Document History Page
Document Number: 38-05538 Rev. *L
Document Title: CY7C1354C/CY7C1356C 9-Mbit (256 K × 36/512 K × 18) Pipelined SRAM with NoBL™ Architecture
Document Number: 38-05538
Revision
*C
*D
*G
*H
*A
*B
*E
*F
*K
*J
*L
**
*I
2756340
3033272
3052882
3186089
3210400
242032
278130
284431
320834
351895
377095
408298
501793
ECN
Submission
08/26/2009 VKN/AESA Updated template
09/19/2010
10/08/2010
03/02/2011
03/30/2011
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
Date
Change
Orig. of
RXU
VKN
RKF
RKF
NJY
NJY
NJY
VBL
NJY
PCI
PCI
PCI
New data sheet
Changed Boundary Scan order to match the B Rev of these devices
Changed TQFP pkg to Lead-free TQFP in Ordering Information section
Added comment of Lead-free BG and BZ packages availability
Changed ISB1 and ISB3 from DC Characteristic table as follows
ISB1: 225 mA-> 130 mA, 200 MHz -> 120 mA, 167 MHz -> 110 mA
ISB3: 225 MHz -> 120 mA, 200 MHz -> 110 mA, 167 MHz -> 100 mA
Add BG and BZ pkg lead-free part numbers to ordering info section
Changed 225 MHz to 250 MHz
Address expansion pins/balls in the pinouts for all packages are modified as
per JEDEC standard
Unshaded frequencies of 250, 200, 166 MHz in AC/DC Tables and Selection
Guide
Changed Θ
6.13 °C/W respectively
Changed Θ
°C/W respectively
Changed Θ
°C/W respectively
Modified V
Added Lead-Free product information
Updated Ordering Information Table
Changed from Preliminary to Final
Changed I
Updated Ordering Information Table
Modified test condition in note# 15 from V
Changed address of Cypress Semiconductor Corporation on Page# 1 from
“3901 North First Street” to “198 Champion Court”
Changed three-state to tri-state.
Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the
Electrical Characteristics Table.
Replaced Package Name column with Package Diagram in the Ordering Infor-
mation table.
Added the Maximum Rating for Supply Voltage on V
Changed t
Switching Characteristics table.
Updated the Ordering Information table.
Included Soft Error Immunity Data
Modified Ordering Information table by including parts that are available and
modified the disclaimer for the Ordering information.
Added
Updated
Added
Minor edits and updated in new template.
Removed obsolete part numbers.
Updated
Updated
Removed pruned part “CY7C1354C-200BGC” from the ordering information
table.
Ordering Code
Acronyms
Package
Ordering
Package
SB2
TH
OL,
JA
JA
JA
, t
and Θ
and Θ
and Θ
V
from 35 to 40 mA
TL
OH
from 25 ns to 20 ns and t
and
Diagrams.
Information.
Diagrams.
test conditions
JC
JC
JC
Units of
for BGA Package from 25 and 6 °C/W to 34.1 and 14.0
for FBGA Package from 27 and 6 °C/W to 16.8 and 3.0
Definitions.
for TQFP Package from 25 and 9 °C/W to 29.41 and
Description of Change
Measure.
CY7C1354C, CY7C1356C
DDQ
TDOV
< V
from 5 ns to 10 ns in TAP AC
DD
DDQ
to V
DDQ
Relative to GND
≤ V
Page 31 of 32
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