CY7C1315BV18-200BZXI Cypress Semiconductor Corp, CY7C1315BV18-200BZXI Datasheet - Page 10

CY7C1315BV18-200BZXI

CY7C1315BV18-200BZXI

Manufacturer Part Number
CY7C1315BV18-200BZXI
Description
CY7C1315BV18-200BZXI
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1315BV18-200BZXI

Format - Memory
RAM
Memory Type
SRAM - Synchronous, QDR II
Memory Size
18M (512K x 36)
Speed
200MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
-40°C ~ 85°C
Package / Case
165-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1315BV18-200BZXI
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Document Number: 38-05620 Rev. *C
Write Cycle Descriptions
Note:
BWS
10. Assumes a Write cycle was initiated per the Write Port Cycle Description Truth Table. NWS
portions of a Write cycle, as long as the set-up and hold requirements are achieved.
0
H
H
H
H
L
L
L
L
/NWS
0
BWS
1
H
H
H
H
L
L
L
L
/NWS
1
L–H
L–H
L–H
L–H
K
(CY7C1311BV18 and CY7C1313BV18)
L–H During the Data portion of a Write sequence :
L–H During the Data portion of a Write sequence :
L–H No data is written into the devices during this portion of a write operation.
L-H During the Data portion of a Write sequence:
K
During the Data portion of a Write sequence:
CY7C1311BV18 − both nibbles (D
CY7C1313BV18 − both bytes (D
CY7C1311BV18 − both nibbles (D
CY7C1313BV18 − both bytes (D
During the Data portion of a Write sequence :
CY7C1311BV18 − only the lower nibble (D
remain unaltered,
CY7C1313BV18 − only the lower byte (D
remain unaltered.
CY7C1311BV18 − only the lower nibble (D
remain unaltered,
CY7C1313BV18 − only the lower byte (D
remain unaltered.
During the Data portion of a Write sequence :
CY7C1311BV18 − only the upper nibble (D
remain unaltered,
CY7C1313BV18 − only the upper byte (D
remain unaltered.
CY7C1311BV18 − only the upper nibble (D
remain unaltered,
CY7C1313BV18 − only the upper byte (D
remain unaltered.
No data is written into the devices during this portion of a write operation.
0
[17:0]
[17:0]
, NWS
[2, 10]
[7:0]
[7:0]
Comments
) are written into the device.
) are written into the device.
) are written into the device,
) are written into the device,
1
, BWS
[8:0]
[8:0]
[17:9]
[17:9]
[3:0]
[3:0]
[7:4]
[7:4]
0
, BWS
) is written into the device. D
) is written into the device. D
) is written into the device. D
) is written into the device. D
) is written into the device. D
) is written into the device. D
) is written into the device. D
) is written into the device. D
1
, BWS
2
and BWS
CY7C1313BV18
CY7C1315BV18
CY7C1311BV18
CY7C1911BV18
3
can be altered on different
Page 10 of 28
[17:9]
[17:9]
[8:0]
[8:0]
[7:4]
[7:4]
[3:0]
[3:0]
will
will
will
will
will
will
will
will
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