AMP02FS-REEL Analog Devices Inc, AMP02FS-REEL Datasheet - Page 3

• Manufacturer Part Number: AMP02FS-REEL
• Description: IC,Instrumentation Amplifier,SINGLE,SOP,16PIN,PLASTIC
• Manufacturer: Analog Devices Inc

Specifications of AMP02FS-REEL

• Rohs Status: RoHS non-compliant
• Amplifier Type: Instrumentation
• Number Of Circuits: 1
• Slew Rate: 6 V/µs
• -3db Bandwidth: 1.2MHz
• Current - Input Bias: 4nA
• Voltage - Input Offset: 40µV
• Current - Supply: 5mA
• Current - Output / Channel: 32mA
• Voltage - Supply, Single/dual (±): ±4.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Output Type: -
• Gain Bandwidth Product: -

ABSOLUTE MAXIMUM RATINGS
Supply Voltage
Common-Mode Input Voltage [(V–) – 60 V] to [(V+) + 60 V]
Differential Input Voltage
Output Short-Circuit Duration
Operating Temperature Range
Storage Temperature Range
Function Temperature Range
Lead Temperature (Soldering, 10 sec)
Package Type
8-Lead Plastic DIP (P)
16-Lead SOIC (S)
REV. E
Parameter
POWER SUPPLY
NOTES
1
2
3
Specifications subject to change without notice.
Input voltage range guaranteed by common-mode rejection test.
Guaranteed by design.
Gain tempco does not include the effects of external component drift.
Supply Voltage Range
Supply Current
–IN
Model
AMP02EP
AMP02FP
AMP02AZ/883C
AMP02FS
AMP02GBC
AMP02FS-REEL 200 µV
Symbol
V
I
96
92
SY
S
JA
3
[(V–) – 60 V] to [(V+) + 60 V]
1, 2
37
27
Conditions
T
–40°C ≤ T
JC
A
V
T
100 µV
200 µV
200 µV
200 µV
–65°C to +150°C
–65°C to +150°C
IOS
= 25°C
A
R
–40°C to +85°C
G1
= 25 C
max @ V
R
Figure 2. Simplified Schematic
G2
Continuous
A
≤ +85°C
Unit
°C/W
°C/W
ORDERING GUIDE
300°C
T
4 mV
8 mV
10 mV
8 mV
8 mV
± 18 V
OOS
A
= 25 C
max @ Temperature
–3–
NOTES
1
2
3
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
θ
device in socket for P-DIP package; θ
printed circuit board for SOIC package.
Range
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
–40°C to +85°C
–40°C to +85°C
Min
± 4.5
JA
is specified for worst case mounting conditions, i.e., θ
AMP02E
Typ
5
5
25k
25k
Package
Description
8-Lead Plastic DIP
8-Lead Plastic DIP
8-Lead CERDIP
16-Lead SOIC
Die
16-Lead SOIC
Max
± 18
6
6
+IN
Min
± 4.5
25k
25k
JA
is specified for device soldered to
AMP02F
Typ
5
5
Max
± 18
6
6
JA
V+
SENSE
OUT
REFERENCE
V–
is specified for
AMP02
Unit
V
mA
mA