AM29F800BT-70EC Spansion Inc., AM29F800BT-70EC Datasheet - Page 2
![Flash Memory IC](/photos/19/5/190557/4427855_sml.jpg)
AM29F800BT-70EC
Manufacturer Part Number
AM29F800BT-70EC
Description
Flash Memory IC
Manufacturer
Spansion Inc.
Datasheets
1.AM29F800BT-90SC.pdf
(44 pages)
2.AM29F800BT-90SC.pdf
(39 pages)
3.AM29F800BT-90SC.pdf
(43 pages)
4.AM29F800BB-90EE.pdf
(45 pages)
Specifications of AM29F800BT-70EC
Memory Size
8Mbit
Memory Configuration
1M X 8 / 512K X 16
Ic Interface Type
Parallel
Access Time
70ns
Memory Case Style
TSOP
No. Of Pins
48
Mounting Type
Surface Mount
Peak Reflow Compatible (260 C)
No
Supply Voltage Max
5.5V
Rohs Compliant
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AM29F800BT-70EC
Manufacturer:
NXP
Quantity:
1 000
Company:
Part Number:
AM29F800BT-70EC
Manufacturer:
AMD
Quantity:
5 380
Part Number:
AM29F800BT-70EC
Manufacturer:
AMD
Quantity:
20 000
GENERAL DESCRIPTION
The Am29F800B is an 8 Mbit, 5.0 volt-only Flash
memory organized as 1,048,576 bytes or 524,288
words. The device is offered in 44-pin SO and 48-pin
TSOP packages. The word-wide data (x16) appears on
DQ15–DQ0; the byte-wide (x8) data appears on DQ7–
DQ0. This device is designed to be programmed in-
system with the standard system 5.0 volt V
A 12.0 V V
tions. The device can also be programmed in standard
EPROM programmers.
This device is manufactured using AMD’s 0.35 µm
process technology, and offers all the features and ben-
efits of the Am29F800, which was manufactured using
0.5 µm process technology.
The standard device offers access times of 55, 70, 90,
120, and 150 ns, allowing high speed microprocessors
to operate without wait states. To eliminate bus conten-
tion the device has separate chip enable (CE#), write
enable (WE#) and output enable (OE#) controls.
The device requires only a single 5.0 volt power sup-
ply for both read and write functions. Internally gener-
ated and regulated voltages are provided for the
program and erase operations.
The device is entirely command set compatible with the
JEDEC single-power-supply Flash standard. Com-
mands are written to the command register using stan-
dard microprocessor write timings. Register contents
serve as input to an internal state-machine that con-
trols the erase and programming circuitry. Write cycles
also internally latch addresses and data needed for the
programming and erase operations. Reading data out
of the device is similar to reading from other Flash or
EPROM devices.
Device programming occurs by executing the program
command sequence. This initiates the Embedded
Program algorithm—an internal algorithm that auto-
matically times the program pulse widths and verifies
proper cell margin.
Device erasure occurs by executing the erase com-
mand sequence. This initiates the Embedded Erase
algorithm—an internal algorithm that automatically
2
PP
is not required for write or erase opera-
P R E L I M I N A R Y
CC
supply.
Am29F800B
preprograms the array (if it is not already programmed)
before executing the erase operation. During erase, the
device automatically times the erase pulse widths and
verifies proper cell margin.
The host system can detect whether a program or
erase operation is complete by observing the RY/BY#
pin, or by reading the DQ7 (Data# Polling) and DQ6
(toggle) status bits. After a program or erase cycle has
been completed, the device is ready to read array data
or accept another command.
The sector erase architecture allows memory sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection measures include a low
V
tions during power transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of the sectors of mem-
ory. This can be achieved via programming equipment.
The Erase Suspend feature enables the user to put
erase on hold for any period of time to read data from,
or program data to, any sector that is not selected for
erasure. True background erase can thus be achieved.
The hardware RESET# pin terminates any operation
in progress and resets the internal state machine to
reading array data. The RESET# pin may be tied to the
system reset circuitry. A system reset would thus also
reset the device, enabling the system microprocessor
to read the boot-up firmware from the Flash memory.
The system can place the device into the standby
mode. Power consumption is greatly reduced in
this mode.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
h i g h e s t l eve l s o f q u a l i t y, r e l i a b i l i t y a n d c o s t
effectiveness. The device electrically erases all
b i t s w i t h i n a s e c t o r s i m u l t a n e o u s l y v i a
F o w l e r -N o r d h e i m t u n n e l i n g . T h e d a t a i s
programmed using hot electron injection.
CC
detector that automatically inhibits write opera-