AM29F040B-120JC Spansion Inc., AM29F040B-120JC Datasheet - Page 5

Flash Memory IC

AM29F040B-120JC

Manufacturer Part Number
AM29F040B-120JC
Description
Flash Memory IC
Manufacturer
Spansion Inc.
Datasheet

Specifications of AM29F040B-120JC

Memory Configuration
512K X 8
Ic Interface Type
Parallel
Access Time
120ns
Memory Case Style
PLCC
No. Of Pins
32
Peak Reflow Compatible (260 C)
No
Supply Voltage Max
5.5V
Leaded Process Compatible
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 6
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 7
Command Definitions . . . . . . . . . . . . . . . . . . . . . 10
Write Operation Status . . . . . . . . . . . . . . . . . . . . 14
November 1, 2006 21445E5
Requirements for Reading Array Data ..................................... 7
Writing Commands/Command Sequences .............................. 7
Program and Erase Operation Status ...................................... 7
Standby Mode .......................................................................... 7
Output Disable Mode................................................................ 8
Autoselect Mode....................................................................... 9
Sector Protection/Unprotection................................................. 9
Hardware Data Protection ........................................................ 9
Reading Array Data ................................................................ 10
Reset Command..................................................................... 10
Autoselect Command Sequence ............................................ 10
Byte Program Command Sequence....................................... 10
Chip Erase Command Sequence ........................................... 11
Sector Erase Command Sequence ........................................ 11
Erase Suspend/Erase Resume Commands........................... 12
Command Definitions ............................................................. 13
DQ7: Data# Polling................................................................. 14
DQ6: Toggle Bit I .................................................................... 15
DQ2: Toggle Bit II ................................................................... 15
Reading Toggle Bits DQ6/DQ2 .............................................. 15
Table 1. Am29F040B Device Bus Operations ...................................7
Table 2. Sector Addresses Table ......................................................8
Table 3. Am29F040B Autoselect Codes (High Voltage Method) .......9
Low V
Write Pulse “Glitch” Protection.......................................................... 9
Logical Inhibit .................................................................................... 9
Power-Up Write Inhibit ...................................................................... 9
Table 4. Am29F040B Command Definitions....................................13
Figure 1. Program Operation ......................................................... 11
Figure 2. Erase Operation.............................................................. 12
Figure 3. Data# Polling Algorithm .................................................. 14
CC
Write Inhibit ........................................................................ 9
D A T A
Am29F040B
S H E E T
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 18
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 18
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 19
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Key to Switching Waveforms. . . . . . . . . . . . . . . . 20
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 21
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 26
Erase and Programming Performance . . . . . . . . 28
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 28
TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . 28
PLCC and PDIP Pin Capacitance. . . . . . . . . . . . . 29
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 30
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 33
DQ5: Exceeded Timing Limits ................................................ 15
DQ3: Sector Erase Timer ....................................................... 16
TTL/NMOS Compatible .......................................................... 19
CMOS Compatible.................................................................. 19
Read Only Operations ............................................................ 21
Erase and Program Operations.............................................. 22
Erase and Program Operations.............................................. 26
PD 032—32-Pin Plastic DIP ................................................... 30
PL 032—32-Pin Plastic Leaded Chip Carrier ......................... 31
TS 032—32-Pin Standard Thin Small Package...................... 32
Table 5. Write Operation Status...................................................... 17
Table 6. Test Specifications ........................................................... 20
Alternate CE# Controlled Writes .................................................... 26
Figure 4. Toggle Bit Algorithm....................................................... 16
Figure 5. Maximum Negative Overshoot Waveform ..................... 18
Figure 6. Maximum Positive Overshoot Waveform....................... 18
Figure 7. Test Setup..................................................................... 20
Figure 8. Read Operation Timings ................................................ 21
Figure 9. Program Operation Timings........................................... 23
Figure 10. Chip/Sector Erase Operation Timings ......................... 23
Figure 11. Data# Polling Timings (During Embedded Algorithms) 24
Figure 12. Toggle Bit Timings (During Embedded Algorithms)..... 24
Figure 13. DQ2 vs. DQ6................................................................ 25
Figure 14. Alternate CE# Controlled Write Operation Timings ..... 27
3

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