AM29F032B-90EC Spansion Inc., AM29F032B-90EC Datasheet - Page 39

• Manufacturer Part Number: AM29F032B-90EC
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of AM29F032B-90EC

• Memory Size: 32Mbit
• Memory Configuration: 4M X 8
• Ic Interface Type: Parallel
• Access Time: 90ns
• Memory Case Style: TSOP
• No. Of Pins: 40
• Operating Temperature Range: 0°C To +70°C
• Termination Type: SMD
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

REVISION SUMMARY
Revision A (June 1998)
Initial release.
Revision B (July 1998)
Distinctive Characteristics
Changed typical active read current to 30 mA to match
DC Characteristics table.
Operating Ranges
Corrected temperature range descriptions to “ambient.”
Revision C (January 1999)
Distinctive Characteristics
Added 20-year data retention subbullet.
Revision C+1 (April 14, 1999)
Deleted duplicate sections in the full data sheet.
Data Retention
Added table.
Revision D (November 17, 1999)
AC Characteristics—Figure 11. Program
Operations Timing and Figure 12. Chip/Sector
Erase Operations
Deleted t
high.
Physical Dimensions
Replaced figures with more detailed illustrations.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those pr
Trademarks
Copyright © 2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof are
trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
Copyright © 1998–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-
marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are
for identification purposes only and may be trademarks of their respective companies.
November 2, 2006 21610D5
GHWL
and changed OE# waveform to start at
D A T A
Am29F032B
S H E E T
Revision D+1 (December 5, 2000)
Added table of contents.
Ordering Information
Deleted burn-in option.
Revision D+2 (November 8, 2004)
Global
Added cover page, colophon, and referenced links
Updated Trademark.
Ordering Information
Added temperature range for Pb-free Packages.
Valid Combinations
Added new combinations.
Revision D3 (December 22, 2005)
Global
Deleted 120 and 150 ns speed options, and deleted re-
verse TSOP package option.
Revision D4 (May 19, 2006)
Added “Not recommended for new designs” note.
AC Characteristics
Changed t
Revision D5 (November 2, 2006)
Deleted “Not recommended for new designs” note.
BUSY
specification to maximium value.
37