AM29DL323GB90EI AMD (ADVANCED MICRO DEVICES), AM29DL323GB90EI Datasheet - Page 3

• Manufacturer Part Number: AM29DL323GB90EI
• Description: Flash Memory IC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29DL323GB90EI

• Memory Configuration: 4M X 8 / 2M X 16 Bit
• Supply Voltage Max: 3.6V
• Access Time, Tacc: 90nS
• Mounting Type: Surface Mount
• Supply Voltage: 3V

TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . .4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 10
Common Flash Memory Interface (CFI) . . . . . . .20
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 22
March 26, 2004
Word/Byte Configuration .................................................................................10
Requirements for Reading Array Data ......................................................... 10
Writing Commands/Command Sequences .................................................. 11
Simultaneous Read/Write Operations with Zero Latency ..................... 11
Standby Mode .........................................................................................................11
Automatic Sleep Mode ....................................................................................... 11
RESET#: Hardware Reset Pin ......................................................................... 12
Output Disable Mode ........................................................................................ 12
Autoselect Mode .................................................................................................. 15
Sector/Sector Block Protection and Unprotection ...................................16
Write Protect (WP#) .........................................................................................17
Temporary Sector Unprotect ..........................................................................17
SecSi
Hardware Data Protection .............................................................................. 19
Reading Array Data ........................................................................................... 22
Reset Command ..................................................................................................23
Autoselect Command Sequence ....................................................................23
Enter SecSi
Byte/Word Program Command Sequence .................................................23
Table 1. Device Bus Operations ......................................................... 10
Accelerated Program Operation ................................................................ 11
Autoselect Functions ...................................................................................... 11
Table 2. Device Bank Divisions .......................................................... 12
Table 3. Top Boot Sector Addresses ................................................. 13
Table 4. Top Boot SecSi
Table 5. Bottom Boot SecSi
Table 6. Autoselect Codes, (High Voltage Method) ............................. 15
Table 7. Top Boot Sector/Sector Block Addresses
for Protection/Unprotection ............................................................... 16
Table 8. Bottom Boot Sector/Sector Block Addresses
for Protection/Unprotection ............................................................... 16
Figure 1. Temporary Sector Unprotect Operation ............................... 17
Figure 2. In-System Sector Protection/ Sector Unprotection
Algorithms....................................................................................... 18
Factory Locked: SecSi Sector Programmed and Protected At
the Factory ........................................................................................................ 19
Customer Lockable: SecSi Sector NOT Programmed or
Protected At the Factory ............................................................................. 19
Low VCC Write Inhibit ............................................................................... 20
Write Pulse “Glitch” Protection ............................................................... 20
Logical Inhibit .................................................................................................. 20
Power-Up Write Inhibit ............................................................................... 20
Table 9. CFI Query Identification String .............................................. 20
Table 10. System Interface String...................................................... 21
Table 11. Device Geometry Definition................................................. 21
Table 12. Primary Vendor-Specific Extended Query............................. 22
Unlock Bypass Command Sequence ........................................................ 24
Figure 3. Program Operation............................................................. 24
TM
(Secured Silicon) Sector Flash Memory Region ......................... 19
TM
Sector/Exit SecSi Sector Command Sequence ...............23
TM
Sector Addresses...................................... 14
TM
Sector Addresses................................. 14
A D V A N C E
Am29DL32xG
I N F O R M A T I O N
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 28
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . 32
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 33
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 36
Erase And Programming Performance . . . . . . . . 48
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 48
TSOP Pin and Fine-Pitch BGA Capacitance. . . . 48
Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 49
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . . 53
Chip Erase Command Sequence ...................................................................24
Sector Erase Command Sequence ................................................................ 25
Erase Suspend/Erase Resume Commands .................................................. 25
DQ7: Data# Polling ............................................................................................28
RY/BY#: Ready/Busy# ....................................................................................... 29
DQ6: Toggle Bit I ............................................................................................... 29
DQ2: Toggle Bit II .............................................................................................. 30
Reading Toggle Bits DQ6/DQ2 ..................................................................... 30
DQ5: Exceeded Timing Limits ........................................................................ 30
DQ3: Sector Erase Timer ................................................................................ 30
Word/Byte Configuration (BYTE#) .............................................................. 38
Erase and Program Operations ...................................................................... 39
Temporary Sector Unprotect ........................................................................44
Alternate CE# Controlled Erase and Program Operations .................46
FBD063—63-ball Fine-Pitch Ball Grid Array (FBGA 8 x 14 mm .........49
FBD048—Fine-Pitch Ball Grid Array, 6 x 12 mm .....................................50
TS 048—Thin Small Outline Package ........................................................... 51
Figure 4. Erase Operation.................................................................. 26
Table 13. Command Definitions......................................................... 27
Figure 5. Data# Polling Algorithm...................................................... 28
Figure 6. Toggle Bit Algorithm ........................................................... 29
Table 14. Write Operation Status .......................................................31
Figure 7. Maximum Negative Overshoot Waveform............................ 32
Figure 8. Maximum Positive Overshoot Waveform.............................. 32
Figure 9. I
Sleep Currents)................................................................................ 34
Figure 10. Typical I
Figure 11. Test Setup....................................................................... 35
Figure 12. Input Waveforms and Measurement Levels........................ 35
Figure 13. Read Operation Timings.................................................... 36
Figure 14. Reset Timings................................................................... 37
Figure 15. BYTE# Timings for Read Operations................................... 38
Figure 16. BYTE# Timings for Write Operations.................................. 38
Figure 17. Program Operation Timings............................................... 40
Figure 18. Accelerated Program Timing Diagram................................ 40
Figure 19. Chip/Sector Erase Operation Timings................................. 41
Figure 20. Back-to-back Read/Write Cycle Timings............................. 42
Figure 21. Data# Polling Timings (During Embedded Algorithms)........ 42
Figure 22. Toggle Bit Timings (During Embedded Algorithms) ............ 43
Figure 23. DQ2 vs. DQ6.................................................................... 43
Figure 24. Temporary Sector Unprotect Timing Diagram..................... 44
Figure 25. Sector/Sector Block Protect and Unprotect Timing
Diagram .......................................................................................... 45
Figure 26. Alternate CE# Controlled Write (Erase/Program)
Operation Timings............................................................................ 47
CC1
Current vs. Time (Showing Active and Automatic
CC1
vs. Frequency................................................. 34
3