ADSP-21369KBPZ-3A Analog Devices Inc, ADSP-21369KBPZ-3A Datasheet - Page 57

• Manufacturer Part Number: ADSP-21369KBPZ-3A
• Description: IC,DSP,32-BIT,CMOS,BGA,256PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Floating Pointr

Specifications of ADSP-21369KBPZ-3A

• Interface: DAI, DPI
• Clock Rate: 400MHz
• Non-volatile Memory: ROM (768 kB)
• On-chip Ram: 256kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 256-BGA Exposed Pad, 256-eBGA, 256-HBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ADZS-21369-EZLITE - KIT EVAL EZ LITE ADDS-21369
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SURFACE-MOUNT DESIGN
Table 47
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 47. BGA_ED Data for Use with Surface-Mount Design
Package
256-Lead Ball Grid Array BGA_ED
(BP-256)
is provided as an aide to PCB design. For industry-
BALL A1
INDICATOR
TOP VIEW
BSC SQ
27.00
Figure 51. 256-Ball Ball Grid Array, Thermally Enhanced [BGA_ED]
Ball Attach Type
Solder Mask Defined (SMD)
DETAIL A
0.10 MIN
1.70 MAX
COMPLIANT TO JEDEC STANDARDS MO-192-BAL-2
0.25 MIN
(4 )
Rev. E | Page 57 of 60 | July 2009
Dimension shown in millimeters
BSC SQ
24.13
(BP-256)
BSC
1.27
0.90
0.75
0.60
DETAIL A
BALL DIAMETER
20
ADSP-21367/ADSP-21368/ADSP-21369
19
18
17
16
Solder Mask Opening
0.63 mm
15
14
13
BOTTOM
12
VIEW
11
10
SEATING
PLANE
9
8
1.00
0.80
0.60
A1 CORNER
INDEX AREA
7
6
5
4
3
COPLANARITY
0.20
2
1
B
C
D
E
F
G
H
K
L
M
N
P
R
U
A
J
T
V
W
Y
0.70
0.60
0.50
Ball Pad Size
0.73 mm