ADP150ACBZ-2.8-R7 Analog Devices Inc, ADP150ACBZ-2.8-R7 Datasheet - Page 18
![150mA LDO 2.8Vout](/photos/7/43/74325/cb-4-3_sml.jpg)
ADP150ACBZ-2.8-R7
Manufacturer Part Number
ADP150ACBZ-2.8-R7
Description
150mA LDO 2.8Vout
Manufacturer
Analog Devices Inc
Datasheet
1.ADP150-BL1-EVZ.pdf
(20 pages)
Specifications of ADP150ACBZ-2.8-R7
Design Resources
Broadband Low EVM Direct Conversion Transmitter (CN0134) Broadband Low EVM Direct Conversion Transmitter Using LO Divide-by-2 Modulator (CN0144) Using low noise linear drop-out regulators to power wideband PLL & VCO IC's (CN0147)
Regulator Topology
Positive Fixed
Voltage - Output
2.8V
Voltage - Input
Up to 5.5V
Voltage - Dropout (typical)
0.105V @ 150mA
Number Of Regulators
1
Current - Output
150mA (Max)
Current - Limit (min)
190mA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
4-WLCSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
ADP150ACBZ-2.8-R7TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ADP150ACBZ-2.8-R7
Manufacturer:
ADI
Quantity:
9 500
Part Number:
ADP150ACBZ-2.8-R7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ADP150
OUTLINE DIMENSIONS
IDENTIFIER
BALL A1
(BALL SIDE DOWN)
* 0.90 MAX
0.70 MIN
TOP VIEW
0.800
0.760 SQ
0.720
0.10 MAX
1.60 BSC
Figure 49. 5-Lead Thin Small Outline Transistor Package [TSOT]
* COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH
THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS.
Figure 50.4-Ball Wafer Level Chip Scale Package [WLCSP]
5
1
2.90 BSC
0.430
0.400
0.370
0.50
0.30
BSC
1.90
2
Dimensions show in millimeters
Dimensions show in millimeters
0.230
0.200
0.170
4
3
Rev. A | Page 18 of 20
0.95 BSC
* 1.00 MAX
2.80 BSC
(CB-4-3)
(UJ-5)
SEATING
PLANE
0.660
0.600
0.540
0.050 NOM
COPLANARITY
0.40
BALL PITCH
0.20
0.08
SEATING
PLANE
8°
4°
0°
0.280
0.260
0.240
0.60
0.45
0.30
BOTTOM VIEW
(BALL SIDE UP)
2
1
A
B