ADP121-ACBZ188R7 Analog Devices Inc, ADP121-ACBZ188R7 Datasheet - Page 5

• Manufacturer Part Number: ADP121-ACBZ188R7
• Description: 150mA Low IQ Low Dropout Reg 1.88v
• Manufacturer: Analog Devices Inc

Specifications of ADP121-ACBZ188R7

• Design Resources: Low power, Long Range, ISM Wireless Measuring Node (CN0164)
• Regulator Topology: Positive Fixed
• Voltage - Output: 1.875V
• Voltage - Input: 2.3 ~ 5.5 V
• Number Of Regulators: 1
• Current - Output: 150mA
• Current - Limit (min): 160mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 4-WLCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Dropout (typical): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADP121-ACBZ188R7TR

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VIN to GND
VOUT to GND
EN to GND
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP121 can be damaged when the junction
temperature limits are exceeded. Monitoring the ambient
temperature does not guarantee that the junction temperature
(T
with high power dissipation and poor thermal resistance, the
maximum ambient temperature may have to be derated.
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. T
the ambient temperature (T
device (P
the package (θ
following formula:
J
) is within the specified temperature limits. In applications
T
J
= T
D
), and the junction-to-ambient thermal resistance of
A
+ (P
JA
). T
D
× θ
J
is calculated from T
JA
)
A
), the power dissipation of the
J
of the device is dependent on
A
and P
Rating
−0.3 V to +6.5 V
−0.3 V to VIN
−0.3 V to +6.5 V
−65°C to +150°C
−40°C to +125°C
JEDEC J-STD-020
D
using the
Rev. D | Page 5 of 20
Junction-to-ambient thermal resistance, θ
modeling and calculation using a four-layer board. The
junction-to-ambient thermal resistance is highly dependent
on the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θ
on PCB material, layout, and environmental conditions. The
specified values of θ
board. Refer to JESD 51-7 and JESD 51-9 for detailed
information on the board construction. For additional
information, see AN-617 Application Note, MicroCSP
Wafer Level Chip Scale Package.
Ψ
measured in °C/W. Ψ
using a four-layer board. The JESD51-12 Guidelines for Reporting
and Using Package Thermal Information states that thermal
characterization parameters are not the same as thermal
resistances. Ψ
through multiple thermal paths rather than a single path as in
thermal resistance, θ
convection from the top of the package as well as radiation
from the package, factors that make Ψ
world applications. Maximum T
temperature (T
Refer to JESD51-8 and JESD51-12 for more detailed
information about Ψ
THERMAL RESISTANCE
θ
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
5-Lead TSOT
4-Ball 0.4 mm Pitch WLCSP
ESD CAUTION
JA
JB
and Ψ
is the junction-to-board thermal characterization parameter
T
J
= T
JB
B
are specified for the worst-case conditions, that is, a
+ (P
JB
B
measures the component power flowing
) and P
D
× Ψ
JA
JB
JB
JB
are based on a 4-layer, 4” × 3”, circuit
. Therefore, Ψ
JB
.
is based on modeling and calculation
D
)
using the following formula:
J
is calculated from the board
JB
thermal paths include
JB
J A
θ
170
260
more useful in real-
may vary, depending
JA
JA
, is based on
Ψ
43
58
JB
ADP121
TM
Unit
°C/W
°C/W