ADG508FBRN Analog Devices Inc, ADG508FBRN Datasheet - Page 17

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ADG508FBRN

Manufacturer Part Number
ADG508FBRN
Description
Multiplexer IC
Manufacturer
Analog Devices Inc
Type
Analog Multiplexerr
Datasheet

Specifications of ADG508FBRN

Peak Reflow Compatible (260 C)
No
No. Of Circuits
8
Leaded Process Compatible
No
Mounting Type
Surface Mount
No. Of Channels
8
Analog Multiplexer Type
Single Ended
Package / Case
16-SOIC
Rohs Status
RoHS non-compliant
Function
Multiplexer
Circuit
1 x 8:1
On-state Resistance
300 Ohm
Voltage Supply Source
Dual Supply
Voltage - Supply, Single/dual (±)
±10.8 V ~ 16.5 V
Current - Supply
20µA
Operating Temperature
-40°C ~ 85°C
Package
16SOIC N
Maximum On Resistance
350@±15V Ohm
Maximum Propagation Delay Bus To Bus
300@±15V ns
Maximum High Level Output Current
20 mA
Multiplexer Architecture
8:1
Maximum Turn-on Time
250@±15V ns
Power Supply Type
Dual
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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0.048 (1.22)
0.042 (1.07)
(0.51)
0.020
R
0.048 (1.22 )
0.042 (1.07)
0.15
0.05
4
8
4.50
4.40
4.30
PIN 1
0.395 (10.03)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.356 (9.04)
0.350 (8.89)
0.385 (9.78)
(PINS DOWN)
3
9
TOP VIEW
IDENTIFIER
Figure 39. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
PIN 1
16
Figure 38. 20-Lead Plastic Leaded Chip Carrier [PLCC]
1
COPLANARITY
19
13
Dimensions shown in inches and (millimeters)
SQ
COMPLIANT TO JEDEC STANDARDS MO-047-AA
SQ
COMPLIANT TO JEDEC STANDARDS MO-153-AB
18
14
5.10
5.00
4.90
0.10
0.056 (1.42)
0.042 (1.07)
Dimensions shown in millimeters
0.050
(1.27)
BSC
0.30
0.19
9
8
Rev. E | Page 17 of 20
1.20
MAX
SEATING
PLANE
BSC
6.40
0.180 (4.57)
0.165 (4.19)
0.120 (3.04)
0.090 (2.29)
(RU-16)
(P-20)
0.20
0.09
0.032 (0.81)
0.026 (0.66)
0.021 (0.53)
0.013 (0.33)
0.20 (0.51)
MIN
0.045 (1.14)
0.025 (0.64)
0.330 (8.38)
0.290 (7.37)
R
0.020 (0.50)
ADG508F/ADG509F/ADG528F
R
0.75
0.60
0.45
BOTTOM
(PINS UP)
VIEW

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