ADG451BR-REEL7 Analog Devices Inc, ADG451BR-REEL7 Datasheet - Page 15

• Manufacturer Part Number: ADG451BR-REEL7
• Description: IC,ANALOG SWITCH,QUAD,SPST,CMOS,SOP,16PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: LC²MOSr

Specifications of ADG451BR-REEL7

• Rohs Status: RoHS non-compliant
• Function: Switch
• Circuit: 4 x SPST - NO
• On-state Resistance: 5 Ohm
• Voltage Supply Source: Dual, Single, Dual Supply
• Voltage - Supply, Single/dual (±): ±5V, 12V, ±15V
• Current - Supply: 0.5µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)

OUTLINE DIMENSIONS
0.25 (0.0098)
0.10 (0.0039)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
4.00 (0.1575)
3.80 (0.1496)
COPLANARITY
Figure 24. 16-Lead Standard Small Outline Package [SOIC_N]
0.10
COMPLIANT TO JEDEC STANDARDS MS-012-AC
Dimensions shown in millimeters and (inches)
16
1
1.27 (0.0500)
10.00 (0.3937)
9.80 (0.3858)
BSC
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
Narrow Body
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
9
8
SEATING
PLANE
(R-16)
6.20 (0.2441)
5.80 (0.2283)
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
(5.33)
0.210
MAX
PIN 1
0.25 (0.0098)
0.17 (0.0067)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
16
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
1
0.100 (2.54)
Figure 26. 16-Lead Plastic Dual In-Line Package [PDIP]
0.800 (20.32)
0.790 (20.07)
0.780 (19.81)
BSC
Dimensions shown in inches and (millimeters)
COMPLIANT TO JEDEC STANDARDS MS-001-AB
8°
0°
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
9
8
Rev. C | Page 15 of 16
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
0.005 (0.13)
MIN
× 45°
Narrow Body
0.015
(0.38)
MIN
SEATING
PLANE
(N-16)
0.015 (0.38)
0.060 (1.52)
GAUGE
PLANE
MAX
0.15
0.05
4.50
4.40
4.30
PIN 1
Figure 25. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
0.430 (10.92)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
16
1
MAX
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
5.10
5.00
4.90
0.10
Dimensions shown in millimeters
0.30
0.19
ADG451/ADG452/ADG453
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
9
8
1.20
MAX
SEATING
PLANE
BSC
6.40
(RU-16)
0.20
0.09
8°
0°
0.75
0.60
0.45