ADG1406BRUZ Analog Devices Inc, ADG1406BRUZ Datasheet - Page 8

• Manufacturer Part Number: ADG1406BRUZ
• Description: 10 Max Ron, ?15V, +12V ICMOS 16:1 MUX
• Manufacturer: Analog Devices Inc
• Series: iCMOS®r
• Type: Analog Multiplexerr

Specifications of ADG1406BRUZ

• Function: Multiplexer
• Circuit: 1 x 8:1
• On-state Resistance: 11.5 Ohm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 12V, 15V
• Current - Supply: 1µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Package: 28TSSOP
• Maximum On Resistance: 25@±4.5V Ohm
• Maximum Propagation Delay Bus To Bus: 160@±15V|250@12V|435@±5V ns
• Multiplexer Architecture: 16:1
• Maximum Turn-off Time: 290@±5V ns
• Maximum Turn-on Time: 335@±5V ns
• Power Supply Type: Single|Dual
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADG1406/ADG1407
ABSOLUTE MAXIMUM RATINGS
T
Table 7.
Parameter
V
V
V
Analog, Digital Inputs
Continuous Current, Sx or Dx Pins
Peak Current, Sx or Dx Pins (Pulsed
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Reflow Soldering, Pb-Free
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
Overvoltages at the Ax, EN, Sx, or Dx pins are clamped by internal diodes.
Limit current to the maximum ratings given.
DD
DD
SS
A
28-Lead TSSOP
32-Lead LFCSP_VQ
Industrial (B Version)
Peak Temperature
Time at Peak Temperature
at 1 ms, 10% Duty Cycle
Maximum)
= 25°C, unless otherwise noted.
to GND
to V
to GND
SS
1
Rating
35 V
−0.3 V to +25 V
+0.3 V to −25 V
V
or 30 mA, whichever
occurs first
Table 5 and Table 6
specifications + 15%
300 mA
550 mA
–40°C to +125°C
–65°C to +150°C
150°C
260 (+0/−5)°C
10 sec to 40 sec
SS
− 0.3 V to V
DD
+ 0.3 V
Rev. A | Page 8 of 20
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
Package Type
28-Lead TSSOP
32-Lead LFCSP_VQ
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
97.9
27.27
JA
θ
14
JC
Unit
°C/W
°C/W