ADG1212YCPZ-500RL7 Analog Devices Inc, ADG1212YCPZ-500RL7 Datasheet - Page 15

• Manufacturer Part Number: ADG1212YCPZ-500RL7
• Description: IC,ANALOG SWITCH,QUAD,SPST,CMOS,LLCC,16PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: iCMOS®r
• Type: Analog Switchr

Specifications of ADG1212YCPZ-500RL7

• Function: Switch
• Circuit: 4 x SPST - NC/NO
• On-state Resistance: 260 Ohm
• Voltage Supply Source: Single, Dual Supply
• Voltage - Supply, Single/dual (±): 10.8 V ~ 13.2 V, ±15 V
• Current - Supply: 1µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN, CSP Exposed Pad
• Package: 16LFCSP EP
• Maximum On Resistance: 475@10.8V Ohm
• Maximum High Level Output Current: 25 mA
• Maximum Turn-off Time: 65@12V ns
• Maximum Turn-on Time: 155@12V ns
• Switch Architecture: SPST
• Power Supply Type: Single|Dual
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADG1212YCPZ-500RL7TR

ORDERING GUIDE
Model
ADG1211YRUZ
ADG1211YRUZ-REEL
ADG1211YRUZ-REEL7
ADG1211YCPZ-500RL7
ADG1211YCPZ-REEL7
ADG1212YRUZ
ADG1212YRUZ-REEL
ADG1212YRUZ-REEL7
ADG1212YCPZ-500RL7
ADG1212YCPZ-REEL7
ADG1213YRUZ
ADG1213YRUZ-REEL
ADG1213YRUZ-REEL7
ADG1213YCPZ-500RL7
ADG1213YCPZ-REEL7
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP_VQ)
Lead Frame Chip Scale Package (LFCSP_VQ)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP_VQ)
Lead Frame Chip Scale Package (LFCSP_VQ)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP_VQ)
Lead Frame Chip Scale Package (LFCSP_VQ)
Rev. A | Page 15 of 16
ADG1211/ADG1212/ADG1213
Package Option
RU-16
RU-16
RU-16
CP-16-3
CP-16-3
RU-16
RU-16
RU-16
CP-16-3
CP-16-3
RU-16
RU-16
RU-16
CP-16-3
CP-16-3