ADE7166ASTZF16-RL Analog Devices Inc, ADE7166ASTZF16-RL Datasheet - Page 15
![IC,Power Metering,QFP,64PIN,PLASTIC](/photos/6/60/66065/505-64-lqfp_sml.jpg)
ADE7166ASTZF16-RL
Manufacturer Part Number
ADE7166ASTZF16-RL
Description
IC,Power Metering,QFP,64PIN,PLASTIC
Manufacturer
Analog Devices Inc
Datasheet
1.ADE7169ASTZF16.pdf
(152 pages)
Specifications of ADE7166ASTZF16-RL
Applications
Energy Measurement
Core Processor
8052
Program Memory Type
FLASH (16 kB)
Controller Series
ADE71xx
Ram Size
512 x 8
Interface
I²C, SPI, UART
Number Of I /o
20
Voltage - Supply
3.135 V ~ 3.465 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ADE7166ASTZF16-RL
Manufacturer:
KOA
Quantity:
50 000
Company:
Part Number:
ADE7166ASTZF16-RL
Manufacturer:
Analog Devices Inc
Quantity:
10 000
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ABSOLUTE MAXIMUM RATINGS
T
Table 11.
Parameter
V
V
V
Input LCD Voltage to AGND, LCDVA,
Analog Input Voltage to AGND, V
Digital Input Voltage to DGND
Digital Output Voltage to DGND
Operating Temperature Range
Storage Temperature Range
64-Lead LQFP, Power Dissipation
1
When used with external resistor divider.
DD
BAT
DCIN
A
LCDVB, LCDVC
(Industrial)
I
Lead Temperature (Soldering, 30 sec)
P
= 25°C, unless otherwise noted.
to DGND
, I
to DGND
to DGND
PA
, I
PB
, and I
N
1
P
, V
N
,
Rating
−0.3 V to +3.7 V
−0.3 V to +3.7 V
−0.3 V to V
−0.3 V to V
−2 V to +2 V
−0.3 V to V
−0.3 V to V
−40°C to +85°C
−65°C to +150°C
300°C
ADE7116/ADE7156/ADE7166/ADE7169/ADE7566/ADE7569
SWOUT
SWOUT
SWOUT
SWOUT
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
Rev. B | Page 15 of 152
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 12. Thermal Resistance
Package Type
64-Lead LQFP
64-Lead LFCSP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
60
27.1
JA
θ
20.5
2.3
JC
Unit
°C/W
°C/W
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