ADA4627-1BRZ Analog Devices Inc, ADA4627-1BRZ Datasheet - Page 5

• Manufacturer Part Number: ADA4627-1BRZ
• Description: 36V High Performance JFET OpAmp
• Manufacturer: Analog Devices Inc

Specifications of ADA4627-1BRZ

• Design Resources: High Speed Instrumentation Amplifier Using AD8271 and ADA4627-1 (CN0122)
• Amplifier Type: J-FET
• Number Of Circuits: 1
• Slew Rate: 84 V/µs
• Gain Bandwidth Product: 19MHz
• Current - Input Bias: 1pA
• Voltage - Input Offset: 70µV
• Current - Supply: 7mA
• Current - Output / Channel: 45mA
• Voltage - Supply, Single/dual (±): ±5 V ~ 15 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Input Voltage Range
Input Current
Differential Input Voltage
Output Short-Circuit Duration to GND
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature (Soldering, 60 sec)
ESD Human Body Model
1
2
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Input pin has clamp diodes to the power supply pins. Input current should
Differential input voltage is limited to ±30 V or the supply voltage, whichever
be limited to 10 mA or less whenever input signals exceed the power supply
rail by 0.3 V.
is less.
1
1
2
Rating
36 V
(V−) − 0.3 V to (V+) + 0.3 V
±10 mA
±V
Indefinite
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
2.5 kV
SY
Rev. B | Page 5 of 16
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages. This
was measured using a standard two-layer board. For the LFCSP
package, the exposed pad should be soldered to a copper plane.
Table 4. Thermal Resistance
Package Type
8-Lead SOIC_N (R-8)
8-Lead LFCSP (CP-8-2)
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
155
77
JA
θ
45
14
JC
ADA4627-1
Unit
°C/W
°C/W