ADA4091-2ACPZ-R2 Analog Devices Inc, ADA4091-2ACPZ-R2 Datasheet - Page 6

• Manufacturer Part Number: ADA4091-2ACPZ-R2
• Description: 36V Micropower Single-Supply R/R OPAMP
• Manufacturer: Analog Devices Inc

Specifications of ADA4091-2ACPZ-R2

• Design Resources: 30 V Low Cost DAC Using AD5292 Digital Potentiometer (CN0111)
• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 0.46 V/µs
• Gain Bandwidth Product: 1.27MHz
• Current - Input Bias: 50nA
• Voltage - Input Offset: 35µV
• Current - Supply: 200µA
• Current - Output / Channel: 20mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 36 V, ±1.35 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-LFCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADA4091-2ACPZ-R2TR

ADA4091-2/ADA4091-4
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Input Current
Output Short-Circuit Duration to GND
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature (Soldering, 60 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Input current should be limited to ±5 mA.
1
Rating
36 V
Refer to the Input
Overvoltage Protection
section
±V
±5 mA
Indefinite
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
SY
Rev. F | Page 6 of 20
THERMAL RESISTANCE
θ
PCB with zero airflow. The exposed pad is soldered to the
application board.
Table 6. Thermal Resistance
Package Type
8-Lead SOIC (R-8)
14-Lead TSSOP (RU-14)
8-Lead LFCSP (CP-8-9)
16-Lead LFCSP (CP-16-17)
ESD CAUTION
JA
is specified for the device soldered on a 4-layer JEDEC standard
θ
155
112
75
55
JA
θ
45
35
12
14
JC
Unit
°C/W
°C/W
°C/W
°C/W