AD9601-250EBZ Analog Devices Inc, AD9601-250EBZ Datasheet - Page 8

• Manufacturer Part Number: AD9601-250EBZ
• Description: 10-Bit 250 Msps LowPwr CMOS ADC
• Manufacturer: Analog Devices Inc

Specifications of AD9601-250EBZ

• Number Of Adc's: 1
• Number Of Bits: 10
• Sampling Rate (per Second): 250M
• Data Interface: Serial
• Inputs Per Adc: 1 Differential
• Input Range: 1.25 Vpp
• Power (typ) @ Conditions: 322mW @ 250MSPS
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9601-250
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9601-250EBZ - BOARD EVALUATION AD9601-250
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD9601
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
ELECTRICAL
ENVIRONMENTAL
AVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
Dx0 Through Dx9 to DRGND
DCO+/DCO− to DRGND
OVRA/OVRB to DGND
CLK+ to AGND
CLK− to AGND
VIN+ to AGND
VIN− to AGND
SDIO/DCS to DGND
PDWN to AGND
CSB to AGND
SCLK/DFS to AGND
Storage Temperature Range
Operating Temperature Range
Lead Temperature
Junction Temperature
(Soldering, 10 sec)
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Rev. 0 | Page 8 of 32
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 6.
Package Type
56-Lead LFCSP (CP-56-2)
Typical θ
Airflow increases heat dissipation, effectively reducing θ
addition, metal in direct contact with the package leads from
metal traces, and through holes, ground, and power planes
reduces the θ
ESD CAUTION
JA
and θ
JA
.
JC
are specified for a 4-layer board in still air.
θ
30.4
JA
θ
2.9
JC
Unit
°C/W
JA
. In