AD9251BCPZ-40 Analog Devices Inc, AD9251BCPZ-40 Datasheet - Page 10

• Manufacturer Part Number: AD9251BCPZ-40
• Description: 14 BIT DUAL 40 Msps Low Power ADC
• Manufacturer: Analog Devices Inc

Specifications of AD9251BCPZ-40

• Number Of Bits: 14
• Sampling Rate (per Second): 40M
• Data Interface: Serial, SPI™
• Number Of Converters: 2
• Power Dissipation (max): 105.5mW
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-LFCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD9251
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
AVDD to AGND
DRVDD to AGND
VIN+A, VIN+B, VIN−A, VIN−B to AGND
CLK+, CLK− to AGND
SYNC to AGND
VREF to AGND
SENSE to AGND
VCM to AGND
RBIAS to AGND
CSB to AGND
SCLK/DFS to AGND
SDIO/DCS to AGND
OEB to AGND
PDWN to AGND
D0A/D0B through D13A/D13B to AGND
DCOA/DCOB to AGND
Operating Temperature Range (Ambient)
Maximum Junction Temperature
Storage Temperature Range (Ambient)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Under Bias
Rating
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−40°C to +85°C
150°C
−65°C to +150°C
Rev. A | Page 10 of 36
THERMAL CHARACTERISTICS
The exposed paddle is the only ground connection for the chip.
The exposed paddle must be soldered to the AGND plane of the
user’s circuit board. Soldering the exposed paddle to the user’s
board also increases the reliability of the solder joints and
maximizes the thermal capability of the package.
Typical θ
plane. As shown in Table 7, airflow improves heat dissipation,
which reduces θ
package leads from metal traces, through holes, ground, and
power planes, reduces the θ
Table 7. Thermal Resistance
Package Type
64-Lead LFCSP
(CP-64-4)
1
2
3
4
ESD CAUTION
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
Per MIL-Std 883, Method 1012.1.
Per JEDEC JESD51-8 (still air).
JA
is specified for a 4-layer PCB with a solid ground
JA
. In addition, metal in direct contact with the
Airflow
Velocity
(m/sec)
0
1.0
2.5
JA
.
θ
23
20
18
JA
1, 2
θ
2.0
JC
1, 3
θ
12
JB
1, 4
Unit
°C/W
°C/W
°C/W