AD8671AR-REEL Analog Devices Inc, AD8671AR-REEL Datasheet - Page 5

• Manufacturer Part Number: AD8671AR-REEL
• Description: IC,Operational Amplifier,SINGLE,SOP,8PIN,PLASTIC
• Manufacturer: Analog Devices Inc

Specifications of AD8671AR-REEL

• Rohs Status: RoHS non-compliant
• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Slew Rate: 4 V/µs
• Gain Bandwidth Product: 10MHz
• Current - Input Bias: 3nA
• Voltage - Input Offset: 20µV
• Current - Supply: 3mA
• Current - Output / Channel: 30mA
• Voltage - Supply, Single/dual (±): 10 V ~ 36 V, ±5 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Output Type: -
• -3db Bandwidth: -

ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature Range (Soldering, 60 sec)
1
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Absolute maximum ratings apply at 25°C, unless otherwise noted.
All Packages
8-Lead Packages
14-Lead Packages
All Packages
1
Rating
36 V
V
±0.7 V
Indefinite
–65°C to +150°C
–40°C to +125°C
–40°C to +85°C
–65°C to +150°C
300°C
S
– to V
S
+
Rev. E | Page 5 of 20
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
See the Applications section for a related discussion on power.
Table 5. Package Characteristics
Package Type
8-Lead MSOP (RM)
8-Lead SOIC_N (R)
14-Lead SOIC_N (R)
14-Lead TSSOP (RU)
1
θ
device soldered on a 4-layer circuit board for surface-mount packages.
JA
is specified for the worst-case conditions, that is., θ
θ
142
120
90
112
JA
1
AD8671/AD8672/AD8674
θ
44
43
36
35
JC
JA
is specified for the
Unit
°C/W
°C/W
°C/W
°C/W