AD8639WARZ-RL Analog Devices Inc, AD8639WARZ-RL Datasheet - Page 5

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AD8639WARZ-RL

Manufacturer Part Number
AD8639WARZ-RL
Description
Dual, Zero Drift, RRIO, 16V Op Amp
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD8639WARZ-RL

Amplifier Type
Auto-Zero
Number Of Circuits
2
Output Type
Rail-to-Rail
Slew Rate
2 V/µs
Gain Bandwidth Product
1.5MHz
Current - Input Bias
1pA
Voltage - Input Offset
3µV
Current - Supply
1.25mA
Current - Output / Channel
37mA
Voltage - Supply, Single/dual (±)
5 V ~ 16 V, ±2.5 V ~ 8 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Input Voltage
Input Current
Differential Input Voltage
Output Short-Circuit Duration to GND
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature (Soldering, 60 sec)
1
2
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Input pins have clamp diodes to the supply pins. Input current should be
Inputs are protected against high differential voltages by internal 1 kΩ series
limited to 10 mA or less whenever input signals exceed either power supply
rail by 0.3 V.
resistors and back-to-back diode-connected N-MOSFETs (with a typical V
1.25 V for V
CM
of 0 V).
1
2
Rating
16 V
GND − 0.3 V to V
±10 mA
±V
Indefinite
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
SY
SY+
+ 0.3 V
T
Rev. F | Page 5 of 20
of
THERMAL RESISTANCE
Table 5. Thermal Resistance
Package Type
5-Lead SOT-23 (RJ-5)
8-Lead SOIC_N (R-8)
8-Lead MSOP (RM-8)
8-Lead LFCSP_WD (CP-8-5)
1
2
ESD CAUTION
θ
Exposed pad is soldered to t
circuit board for surface-mount packages. This was measured using a
standard two-layer board.
JA
is specified for the worst-case conditions, that is, a device soldered in a
he application board.
2
θ
230
158
206
75
JA
1
AD8638/AD8639
θ
146
43
44
18
JC
Unit
°C/W
°C/W
°C/W
°C/W

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