AD8552ARU Analog Devices Inc, AD8552ARU Datasheet - Page 22

• Manufacturer Part Number: AD8552ARU
• Description: Operational Amplifier IC Number Of Amplifiers:1
• Manufacturer: Analog Devices Inc
• Type: General Purpose Amplifierr

Specifications of AD8552ARU

• Bandwidth: 1.5MHz
• Slew Rate: 0.4V/us
• Package/case: 8-TSSOP
• Leaded Process Compatible: No
• Amplifier Type: Rail - Rail Input And Output
• Bias Current: 0.05nA
• Rohs Status: RoHS non-compliant
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 1.5MHz
• Current - Input Bias: 10pA
• Voltage - Input Offset: 1000µV
• Current - Supply: 850µA
• Current - Output / Channel: 30mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP
• Rail/rail I/o Type: Rail to Rail Input/Output
• Number Of Elements: 2
• Unity Gain Bandwidth Product: 1.5MHz
• Common Mode Rejection Ratio: 120dB
• Input Offset Voltage: 5uV
• Input Bias Current: 50pA
• Single Supply Voltage (typ): 3V
• Dual Supply Voltage (typ): Not RequiredV
• Voltage Gain In Db: 145dB
• Power Supply Rejection Ratio: 120dB
• Power Supply Requirement: Single
• Shut Down Feature: No
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Technology: CMOS
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: TSSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Not Compliant

AD8551/AD8552/AD8554
OUTLINE DIMENSIONS
0.95
0.85
0.75
COPLANARITY
Figure 72. 8-Lead Thin Shrink Small Outline Package [TSSOP]
0.15
0.00
COPLANARITY
0.15
0.05
3.20
3.00
2.80
PIN 1
Figure 71. 8-Lead Mini Small Outline Package [MSOP]
0.10
PIN 1
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
COMPLIANT TO JEDEC STANDARDS MO-153-AA
0.38
0.22
8
1
0.65 BSC
3.20
3.00
2.80
0.65 BSC
8
1
Dimensions shown in millimeters
Dimensions shown in millimeters
3.10
3.00
2.90
0.30
0.19
5
4
5
4
SEATING
PLANE
SEATING
PLANE
5.15
4.90
4.65
1.10 MAX
1.20
MAX
4.50
4.40
4.30
(RM-8)
(RU-8)
COPLANARITY
0.23
0.08
6.40 BSC
0.25 (0.0098)
0.10 (0.0039)
0.20
0.09
0.10
4.00 (0.1575)
3.80 (0.1496)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
8°
0°
8°
0°
Figure 75. 14-Lead Standard Small Outline Package [SOIC_N]
14
1
1.27 (0.0500)
0.51 (0.0201)
0.31 (0.0122)
8.75 (0.3445)
8.55 (0.3366)
COMPLIANT TO JEDEC STANDARDS MS-012-AB
Dimensions shown in millimeters and (inches)
BSC
0.75
0.60
0.45
0.80
0.60
0.40
8
7
Rev. D | Page 22 of 24
Narrow Body (R-14)
6.20 (0.2441)
5.80 (0.2283)
SEATING
PLANE
1.75 (0.0689)
1.35 (0.0531)
COPLANARITY
COPLANARITY
0.25 (0.0098)
0.17 (0.0067)
0.25 (0.0098)
0.10 (0.0040)
1.05
1.00
0.80
PIN 1
4.50
4.40
4.30
0.10
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.15
0.05
4.00 (0.1574)
3.80 (0.1497)
Figure 74. 14-Lead Thin Shrink Small Outline Package [TSSOP]
8°
0°
Figure 73. 8-Lead Standard Small Outline Package [SOIC_N]
SEATING
14
1
0.65 BSC
PLANE
Dimensions shown in millimeters and (inches)
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MS-012-A A
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
5.10
5.00
4.90
0.50 (0.0197)
0.25 (0.0098)
5.00 (0.1968)
4.80 (0.1890)
1.27 (0.0500)
1.27 (0.0500)
0.40 (0.0157)
1
8
Dimensions shown in millimeters
BSC
8
7
5
4
0.51 (0.0201)
0.31 (0.0122)
Narrow Body (R-8)
BSC
6.40
SEATING
PLANE
6.20 (0.2441)
5.80 (0.2284)
1.20
MAX
45°
1.75 (0.0688)
1.35 (0.0532)
(RU-14)
0.20
0.09
0.25 (0.0098)
0.17 (0.0067)
8°
0°
8°
0°
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
0.40 (0.0157)
0.75
0.60
0.45
45°