AD8396ACPZ-RL Analog Devices Inc, AD8396ACPZ-RL Datasheet - Page 4

• Manufacturer Part Number: AD8396ACPZ-RL
• Description: ADSL+2 DSL Line Driver For CO
• Manufacturer: Analog Devices Inc
• Type: Line Driver, Transmitterr

Specifications of AD8396ACPZ-RL

• Number Of Drivers/receivers: 2/0
• Voltage - Supply: 6 V ~ 24 V
• Mounting Type: Surface Mount
• Package / Case: 16-LFCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Protocol: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD8396
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage, V
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JEDEC test board. θ
Table 3.
Package Type
16-Lead LFCSP
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8396 is limited
by its junction temperature on the die.
The maximum safe junction temperature of plastic encapsulated
devices, as determined by the glass transition temperature of the
plastic, is 150°C. Exceeding this limit can temporarily cause a shift
in the parametric performance due to a change in the stresses
exerted on the die by the package. Exceeding this limit for an
extended period can result in device failure.
JA
is specified in still air with exposed pad soldered to 4-layer
CC
− V
JC
is specified at the exposed pad.
EE
θ
56
JA
θ
9.1
JC
Rating
26.4 V
See Figure 3
−65°C to +150°C
−40°C to +85°C
300°C
150°C
Unit
°C/W
Rev. C | Page 4 of 12
Figure 3 shows the maximum power dissipation in the package
vs. the ambient temperature for the 16-lead LFCSP on a JEDEC
standard 4-layer board. θ
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
quiescent current (I
to midsupply, the total drive power is V
is dissipated in the package and part in the load (V
RMS output voltages should be considered. If R
V
In single supply with R
Airflow increases heat dissipation, effectively reducing θ
addition, more copper in direct contact with the package leads
from PCB traces, through-holes, ground, and power planes
reduces θ
ESD CAUTION
EE
, as in single-supply operation, the total power is V
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
–25
JA
.
–15
Ambient Temperature for a 4-Layer Board
Figure 3. Maximum Power Dissipation vs.
–5
S
). Assuming that the load R
L
AMBIENT TEMPERATURE (°C)
5
to V
JA
values are approximations.
15
EE
, worst case is V
25
35
D
S
45
) is the sum of the
/2 × I
55
OUT
OUT
L
S
L
) times the
65
, part of which
is referenced to
T
is referenced
= V
J
OUT
= 150°C
75
S
S
× I
/2.
× I
JA
OUT
85
. In
OUT
).
.