AD8324JRQ-REEL7 Analog Devices Inc, AD8324JRQ-REEL7 Datasheet - Page 11

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AD8324JRQ-REEL7

Manufacturer Part Number
AD8324JRQ-REEL7
Description
IC,TV/VIDEO CIRCUIT,Driver,SSOP,20PIN,PLASTIC
Manufacturer
Analog Devices Inc
Datasheet
Table 7. Adjacent Channel Power
Channel Symbol Rate (kSym/s)
160
320
640
1280
2560
5120
POWER SUPPLY
The 3.3 V supply should be delivered to each of the V
a low impedance power bus. This ensures that each pin is at the
same potential. The power bus should be decoupled to ground
using a 10 μF tantalum capacitor located close to the AD8324.
In addition to the 10 μF capacitor, V
to ground with ceramic chip capacitors located close to the pins.
The bypass pin, labeled BYP, should also be decoupled. The
PCB should have a low impedance ground plane covering all
unused portions of the board, except in areas of the board
where input and output traces are in close proximity to the
AD8324 and the output transformer. All AD8324 ground pins
must be connected to the ground plane to ensure proper
grounding of all internal nodes.
SIGNAL INTEGRITY LAYOUT CONSIDERATIONS
Careful attention to printed circuit board layout details will
prevent problems due to board parasitics. Proper RF design
techniques are mandatory. The differential input and output
traces should be kept as short as possible. Keeping the traces
short will minimize parasitic capacitance and inductance, which
is most critical between the outputs of the AD8324 and the 1:1
output transformer. It is also critical that all differential signal
paths be symmetrical in length and width. In addition, the
Z
IN
= 150Ω
DATEN
SDATA
SLEEP
V
V
TXEN
IN+
CLK
IN–
V
CC
CC
0.1μF
174Ω
0.1μF
pins should be decoupled
1kΩ
1kΩ
1kΩ
1kΩ
1kΩ
10μF
160
–63
–63
–64
–67
–70
–72
10
1
2
3
4
5
6
7
8
9
CC
Figure 23. Typical Application Circuit
GND
GND
GND
V
V
GND
DATEN
SDATA
CLK
V
pins via
CC
IN+
IN–
AD8324-JRQ
Rev. A | Page 11 of 16
320
–64
–64
–64
–65
–67
–70
Adjacent Channel Symbol Rate (kSym/s)
SLEEP
RAMP
V
V
TXEN
OUT+
GND
OUT–
GND
BYP
V
NC
input and output traces should be adequately spaced to
minimize coupling (crosstalk) through the board. Following
these guide-lines will optimize the overall performance of the
AD8324 in all applications.
INITIAL POWER-UP
When the supply voltage is first applied to the AD8324, the gain
of the amplifier is initially set to gain code 1. As power is first
applied to the amplifier, the TXEN pin should be held low
(Logic 0) to prevent forward signal transmission. After power
has been applied to the amplifier, the gain can be set to the
desired level by following the procedure provided in the Gain
Programming for the AD8324 section. The TXEN pin can then
be brought from Logic 0 to Logic 1, enabling forward signal
transmission at the desired gain level.
RAMP PIN AND BYP PIN FEATURES
The RAMP pin (Pin 15) is used to control the length of the burst
on and off transients. By default, leaving the RAMP pin
unconnected will result in a transient that is fully compliant with
DOCSIS 2.0 Section 6.2.21.2, Spurious Emissions During Burst
On/Off Transients. DOCSIS requires that all between burst
transients must be dissipated no faster than 2 μs. Adding
capacitance to the RAMP pin will slow the dissipation even more.
CC
640
–68
–66
–65
–65
–66
–67
20
19
18
17
16
15
14
13
12
11
0.1μF
0.1μF
1280
–71
–70
–67
–66
–66
–67
1:1
TOKO 458PT-1556
TO DIPLEXER
Z
2560
–72
–72
–71
–68
–67
–64
IN
= 75Ω
5120
–66
–67
–67
–67
–65
–64
AD8324

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