AD8222HACPZ-RL Analog Devices Inc, AD8222HACPZ-RL Datasheet - Page 6

• Manufacturer Part Number: AD8222HACPZ-RL
• Description: Hidden Paddle Dual Precision InAmp
• Manufacturer: Analog Devices Inc

Specifications of AD8222HACPZ-RL

• Amplifier Type: Instrumentation
• Number Of Circuits: 2
• Slew Rate: 2 V/µs
• -3db Bandwidth: 1.2MHz
• Current - Input Bias: 500pA
• Voltage - Input Offset: 120µV
• Current - Supply: 900µA
• Current - Output / Channel: 18mA
• Voltage - Supply, Single/dual (±): 4.6 V ~ 36 V, ±2.3 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-LFCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• Gain Bandwidth Product: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD8222
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
Output Short-Circuit Current Duration
Input Voltage (Common Mode)
Differential Input Voltage
Storage Temperature Range
Operational Temperature Range
Package Glass Transition Temperature (T
ESD
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions may affect device reliability.
Human Body Model
Charge Device Model
G
)
Rating
±18 V
Indefinite
±V
±V
−65°C to +130°C
−40°C to +125°C
130°C
1 kV
1 kV
S
S
Rev. A | Page 6 of 24
THERMAL RESISTANCE
Table 6.
Package
CP-16-19: LFCSP Without Thermal Pad
CP-16-13: LFCSP with Thermal Pad
The θ
board. For the LFCSP with thermal pad, it is assumed that the
thermal pad is soldered to a landing on the PCB board, with the
landing thermally connected to a heat dissipating power plane.
θ
Maximum Power Dissipation
The maximum safe power dissipation for the AD8222 is limited
by the associated rise in junction temperature (T
approximately 130C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the amplifiers. Exceeding a temperature of 130°C for an
extended period can result in a loss of functionality.
ESD CAUTION
JC
at the exposed pad is 4.4°C/W.
JA
values in Table 6 assume a 4-layer JEDEC standard
θ
86
48
JA
J
) on the die. At
Unit
°C/W
°C/W