AD8197BASTZ Analog Devices Inc, AD8197BASTZ Datasheet - Page 5

• Manufacturer Part Number: AD8197BASTZ
• Description: IC,Telecom Switching Circuit,QFP,100PIN,PLASTIC
• Manufacturer: Analog Devices Inc

Specifications of AD8197BASTZ

• Function: Switch
• Circuit: 1 x 4:1
• On-state Resistance: 50 Ohm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 3 V ~ 3.6 V
• Current - Supply: 40mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
AVCC to AVEE
DVCC to DVEE
DVEE to AVEE
VTTI
VTTO
AMUXVCC
Internal Power Dissipation
High Speed Input Voltage
High Speed Differential Input Voltage
Low Speed Input Voltage
I
Storage Temperature Range
Operating Temperature Range
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
2
C and Parallel Logic Input Voltage
Rating
3.7 V
3.7 V
±0.3 V
AVCC + 0.6 V
AVCC + 0.6 V
5.5 V
2.2 W
AVCC − 1.4 V < V
AVCC + 0.6 V
2.0 V
DVEE − 0.3 V < V
AMUXVCC + 0.6 V
DVEE − 0.3 V < V
DVCC + 0.6 V
−65°C to +125°C
−40°C to +85°C
150°C
IN
IN
IN
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THERMAL RESISTANCE
θ
in a 4-layer JEDEC circuit board for surface-mount packages.
θ
Table 3. Thermal Resistance
Package Type
100-Lead LQFP
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8197B
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure. To ensure proper operation, it
is necessary to observe the maximum power rating as determined
by the coefficients in Table 3.
ESD CAUTION
JA
JC
is specified for the worst-case conditions: a device soldered
is specified for no airflow.
θ
56
JA
θ
19
JC
AD8197B
Unit
°C/W