AD5445YRU-REEL Analog Devices Inc, AD5445YRU-REEL Datasheet - Page 28

• Manufacturer Part Number: AD5445YRU-REEL
• Description: IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,TSSOP,20PIN
• Manufacturer: Analog Devices Inc

Specifications of AD5445YRU-REEL

• Rohs Status: RoHS non-compliant
• Settling Time: 80ns
• Number Of Bits: 12
• Data Interface: Parallel
• Number Of Converters: 1
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 25µW
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• For Use With: EVAL-AD5445EBZ - BOARD EVALUATION FOR AD5445

AD5424/AD5433/AD5445
OUTLINE DIMENSIONS
0.15
0.05
4.50
4.40
4.30
PIN 1
Figure 63. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
16
1
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
5.10
5.00
4.90
0.10
Dimensions shown in millimeters
0.30
0.19
9
8
1.20
MAX
SEATING
PLANE
BSC
6.40
INDICATOR
SEATING
(RU-16)
PLANE
0.20
0.09
1.00
0.85
0.80
PIN 1
12° MAX
Figure 65. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
8°
0°
TOP VIEW
BSC SQ
4.00
0.80 MAX
0.65 TYP
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
4 mm × 4 mm Body, Very Thin Quad
Dimensions shown in millimeters
BCS SQ
3.75
0.20 REF
0.75
0.60
0.45
Rev. B | Page 28 of 32
0.05 MAX
0.02 NOM
COPLANARITY
(CP-20-1)
0.60 MAX
0.08
BSC
0.75
0.60
0.50
0.50
COPLANARITY
0.60 MAX
15
0.15
0.05
11
PIN 1
16
Figure 64. 20-Lead Thin Shrink Small Outline Package [TSSOP]
10
(BOTTOM VIEW)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.10
EXPOSED
PAD
20
1
BSC
0.65
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
6
1
5
6.60
6.50
6.40
Dimensions shown in millimeters
1.20 MAX
2.25
2.10 SQ
1.95
0.25 MIN
11
10
SEATING
PLANE
(RU-20)
4.50
4.40
4.30
0.20
0.09
6.40 BSC
8°
0°
0.75
0.60
0.45