BZX84J-B51,115 NXP Semiconductors, BZX84J-B51,115 Datasheet - Page 9
![DIODE ZENER 51V 550MW SC-90](/photos/5/29/52913/sc-90_sod323f_pkg_sml.jpg)
BZX84J-B51,115
Manufacturer Part Number
BZX84J-B51,115
Description
DIODE ZENER 51V 550MW SC-90
Manufacturer
NXP Semiconductors
Datasheet
1.BZX84J-C18115.pdf
(12 pages)
Specifications of BZX84J-B51,115
Package / Case
SC-90, SOD-323F
Voltage - Zener (nom) (vz)
51V
Voltage - Forward (vf) (max) @ If
900mV @ 10mA
Current - Reverse Leakage @ Vr
50nA @ 35.7V
Tolerance
±2%
Power - Max
550mW
Impedance (max) (zzt)
110 Ohm
Mounting Type
Surface Mount
Operating Temperature
-65°C ~ 150°C
Zener Voltage
51 V
Voltage Tolerance
2 %
Voltage Temperature Coefficient
51.9 mV / K
Power Dissipation
550 mW
Maximum Reverse Leakage Current
0.05 uA
Maximum Zener Impedance
110 Ohms
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934060967115
BZX84J-B51 T/R
BZX84J-B51 T/R
BZX84J-B51 T/R
BZX84J-B51 T/R
NXP Semiconductors
8. Package outline
9. Packing information
10. Soldering
BZX84J_SER_1
Product data sheet
Table 10.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
BZX84J-B2V4 to
BZX84J-C75
Fig 7. Package outline SOD323F (SC-90)
Fig 8. Reflow soldering footprint SOD323F (SC-90)
For further information and the availability of packing methods, see
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
Packing methods
0.95
Package
SOD323F
Dimensions in mm
0.50
(2 )
Rev. 01 — 1 March 2007
2.7
2.3
Description
4 mm pitch, 8 mm tape and reel
1.8
1.6
3.05
2.80
2.10
1.60
1.35
1.15
1
2
0.40
0.25
0.50
msa433
0.60
0.5
0.3
Section
0.80
0.65
BZX84J series
0.25
0.10
[1]
04-09-13
13.
Single Zener diodes
solder lands
solder resist
occupied area
solder paste
Packing quantity
3000
-115
© NXP B.V. 2007. All rights reserved.
10000
-135
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