IDG-500 INVENSENSE, IDG-500 Datasheet - Page 20

• Manufacturer Part Number: IDG-500
• Description: GYRO, DUAL (X+Y) AXIS, +/-500 DEG/S
• Manufacturer: INVENSENSE

Specifications of IDG-500

• No. Of Axes: 2
• Sensor Case Style: QFN
• No. Of Pins: 28
• Supply Voltage Range: 2.7V To 3.3V
• Operating Temperature Range: -20°C To +85°C
• Sensitivity Per Axis: 2mV / ° / S
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

9.5
Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited.
9.6
The exposed die pad is internally connected to VSS. The exposed die pad should not be soldered to the
PCB since soldering to it contributes to performance changes due to package thermo-mechanical stress.
9.7
Testing indicates that there are no specific design considerations other than generally accepted industry
design practices for component placement near the IDG-500 gyroscope to prevent noise coupling, and
thermo-mechanical stress.
9.8
Orientation error of the gyroscope mounted to the printed circuit board can cause cross-axis sensitivity in
which one gyro responds to rotation about the other axis, for example, the Y-axis gyroscope responding to
rotation about the X-axis. The orientation mounting error is illustrated in Figure 12.
The table below shows the cross-axis sensitivity as a percentage of the specified gyroscope’s sensitivity for a
given orientation error.
The specification for cross-axis sensitivity in Section 7.1 includes the effect of the die orientation error with
respect to the package.
9.9
The gyro pins marked XAGC and YAGC are high impedance nodes that are sensitive to current leakage,
which can impact gyroscope performance. Care should be taken to ensure that these nodes are not
contaminated by residue such as flux and are clean.
9.10 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundredstens of
millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior to
mounting onto printed circuit boards (PCBs).
CONFIDENTIAL & PROPRIETARY
Trace Routing
Soldering Exposed Die Pad
Component Placement
PCB Mounting and Cross-Axis Sensitivity
AGC Nodes
Packaged Gyro Axis (-----) Relative to PCB Axes (
Orientation Error
IDG-500 Dual-Axis Gyroscope
Theta (θ)
0.5º
Product Specification
0º
1º
Y
20 of 25
Figure 11
PCB
IDG-500
Cross-Axis Sensitivity
θ
X
0.87%
1.75%
|sinθ|
0%
) with Orientation Error
PS-IDG-0500B-00-06
Release Date: 07/28/09
θ
.